Patents by Inventor Ben Han

Ben Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12025660
    Abstract: A system of performing boundary scan test on pin through test point and a method thereof are disclosed. When an under-test pin of a target connector is determined to be unable to perform a boundary scan test, a test point connected to and closest to the under-test pin is searched, a test signal is transmitted to a target connector, a result signal from the target connector in response to the test signal is received, an expected result and the result signal are compared to generate a test result, so that a boundary scan function can be applied to test a connector of a computer product, to achieve the technical effect of providing a better test range and a better test coverage to improve test efficiency and reduce test cost, compared to conventional boundary scan test.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 2, 2024
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Qiu-Yue Duan, Xin-Ying Xie, Ben Han
  • Patent number: 11435400
    Abstract: A test coverage rate improvement system for pins of tested circuit board and a method thereof are disclosed. In the system, partial pins of a circuit board connector in a tested circuit board are not electrically connected to the boundary scan chip, test pins of the test pin board are pressed with the partial pins by a fixture of a boundary scan interconnect testing workstation to electrically connect the test pins to the partial pins. A test access port controller receives a detection signal for detecting the partial pins, which are not electrically connected to the boundary scan chip, of the circuit board connector through the test pin board from the test adapter card, and determines whether conduction is formed based on the detection signal, thereby achieving the technical effect of improving a test coverage rate for the pins of the tested circuit board.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: September 6, 2022
    Assignees: Inventec (Pudong) Technology Corporation, Inventec Corporation
    Inventors: Qiu-Yue Duan, Ben Han, Xin-Ying Xie