Patents by Inventor BEN HUNG

BEN HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936645
    Abstract: Security functions for a memory corresponding to a smart security storage may be facilitated or executed through operation of utility application corresponding to a smart device. For example, encryption/decryption of data stored on the memory may be facilitated or executed by a security module under control of an access application corresponding to the smart device. Data securely stored on the memory may be explored and accessed by the smart device or a host computing device under control of the access application.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 19, 2024
    Assignee: Kingston Digital, Inc.
    Inventors: Ben Wei Chen, Chih-Hung Wu
  • Patent number: 11925725
    Abstract: An extracellular matrix (ECM) mixture and ECM scaffolds made with same are disclosed. The ECM mixture can comprise from about 5% to about 85% by weight of ECM material and from about 15% to about 95% by weight of a polymer material, such as, but not limited to, a biodegradable polyester. The presently disclosed anatomically-shaped porous ECM scaffolds can be formed, for example, using a three-dimensional (3D) printing process, an injection molding process, or any other process.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: March 12, 2024
    Assignee: JOHNS HOPKINS UNIVERSITY
    Inventors: Warren Grayson, Jennifer Elisseeff, Ben Hung, Ethan Nyberg, Tram Nguyen
  • Publication number: 20180185547
    Abstract: An extracellular matrix (ECM) mixture and ECM scaffolds made with same are disclosed. The ECM mixture can comprise from about 5% to about 85% by weight of ECM material and from about 15% to about 95% by weight of a polymer material, such as, but not limited to, a biodegradable polyester. The presently disclosed anatomically-shaped porous ECM scaffolds can be formed, for example, using a three-dimensional (3D) printing process, an injection molding process, or any other process.
    Type: Application
    Filed: June 24, 2016
    Publication date: July 5, 2018
    Inventors: WARREN GRAYSON, JENNIFER ELISSEEFF, BEN HUNG, ETHAN NYBERG
  • Patent number: 7204750
    Abstract: An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: April 17, 2007
    Assignee: First International Computer, Inc.
    Inventors: Ben Hung-Ping Shen, Chei-Ju Tsai, Han-Tun Chen, Ting-Chiang Huang