Abstract: A collapsible chair is disclosed having an arcuate frame with an upward peak and a downward peak for seating of a user in the downward peak and resting of the user's legs upon the upward peak. The frame may have a pivotal connection between the peaks for collapsing the frame. A linkage is disclosed operably connected to the frame for providing legs to the chair in an extended position and for collapsing with the frame.

Abstract: A system and method for recycling a workpiece comprises an electrolytic etching assembly for etching a metal layer of the workpiece. The electrolytic etching assembly has an electroetching unit, a working stage, a power supply and an electrolyte source supply. The electroetching unit has an anode, a cathode next to the anode and an insulting covering, wherein the cathode and the anode are separated by the insulting covering which covers the anode. The working stage is provided for carrying the workpiece so as to allow the metal layer to face the anode and the cathode. The power supply has a positive electrode connected with the anode of the electroetching unit, and a negative electrode connected with the cathode. In addition, the electrolyte source supply is communicated with the insulting covering of the electroetching unit, and pours an electrolyte solution onto the anode and thereafter impinging upon the workpiece and passing through a passage defined by the workpiece and the anode.

Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: A collapsible chair is disclosed having an arcuate frame with an upward peak and a downward peak for seating of a user in the downward peak and resting of the user's legs upon the upward peak. The frame may have a pivotal connection between the peaks for collapsing the frame. A linkage is disclosed operably connected to the frame for providing legs to the chair in an extended position and for collapsing with the frame.

Abstract: A system and the method thereof are used for automatically recycling a flat glass from a workpiece. The system includes a first stripper, a second stripper, at least one loader, a residue-removing device, a clean device, and an excimer device. The first stripper is used for removing a metal thin film from the workpiece when the workpiece is transported to the first stripper by the at least one loader. The second stripper is used for removing an organic thin film from the workpiece when the workpiece is transported to the second stripper by the at least one loader. The residue-removing device has a brush for removing the residues from the workpiece. The clean device is used for rinsing and drying the workpiece. The excimer device is used for removing a smooth thin film from the workpiece to obtain the flat glass.

Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: A high-pressure pad cleaning system that can be used in conjunction with semiconductor device fabrication tools that utilize pads, such as chemical-mechanical polishing (CMP) tools, is disclosed. A system includes a turntable, first and second outlets, and a dresser. A pad is placed on the turntable, where the turntable rotates in a first direction. The first outlet supplies a dressing solution, such as deionized water, onto the pad at a first pressure, substantially at a single point on the center of the pad. The second outlet supplies the solution onto the pad at a second pressure greater than the first pressure, substantially at a radial line from the center of the pad to its edge at an angle and in a direction opposite to the first direction.

Abstract: A high-pressure pad cleaning system that can be used in conjunction with semiconductor device fabrication tools that utilize pads, such as chemical-mechanical polishing (CMP) tools, is disclosed. A system includes a turntable, first and second outlets, and a dresser. A pad is placed on the turntable, where the turntable rotates in a first direction. The first outlet supplies a dressing solution, such as deionized water, onto the pad at a first pressure, substantially at a single point on the center of the pad. The second outlet supplies the solution onto the pad at a second pressure greater than the first pressure, substantially at a radial line from the center of the pad to its edge at an angle and in a direction opposite to the first direction.

Abstract: A self-cleaning apparatus for use in a chemical mechanical polishing tool. The apparatus includes a slurry-dispensing arm with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. A slurry-dispensing nozzle is positioned under the first end for dispensing a polishing slurry against the polishing pad. The first end has a compound slanted top surface, a front face and adjoining side surfaces. The compound slanted top surface forms a longitudinal peak slanting from center to both sides and from the back end to the front face. The top surface of the first end has a liquid distribution manifold that is mounted distally from the front face and has a plurality of nozzles directed to spray deionized water to wash away slurry splatter from surfaces of the first end of the slurry dispensing arm during the water polishing cycle.