Patents by Inventor Ben M. CHEN

Ben M. CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12511767
    Abstract: A deep learning network can perform three-dimensional (3D) image reconstruction of a scene from multi-view calibrated two-dimensional (2D) images. The network can include a convolutional neural network that performs feature extraction to generate feature pyramids corresponding to features at different levels of resolution. The feature pyramids can be used to compute a respective cost volume for each feature pyramid at each level of resolution, with the cost volume incorporating a learnable parameter that corresponds to a weight allocated to the “reference” feature pyramid relative to other feature pyramids. A depth map for each input image can be generated based at least in part on the cost volume.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: December 30, 2025
    Assignee: HONG KONG CENTRE FOR LOGISTICS ROBOTICS LIMITED
    Inventors: Ben M. Chen, Guidong Yang, Chuanxiang Gao, Xi Chen, Jihan Zhang, Benyun Zhao
  • Publication number: 20250022153
    Abstract: A deep learning network can perform three-dimensional (3D) image reconstruction of a scene from multi-view calibrated two-dimensional (2D) images. The network can include a convolutional neural network that performs feature extraction to generate feature pyramids corresponding to features at different levels of resolution. The feature pyramids can be used to compute a respective cost volume for each feature pyramid at each level of resolution, with the cost volume incorporating a learnable parameter that corresponds to a weight allocated to the “reference” feature pyramid relative to other feature pyramids. A depth map for each input image can be generated based at least in part on the cost volume.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 16, 2025
    Inventors: Ben M. CHEN, Guidong YANG, Chuanxiang GAO, Xi CHEN, Jihan ZHANG, Benyun ZHAO