Patents by Inventor BEN MINT PON

BEN MINT PON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shear thinning build material slurry
    Patent number: 12703144
    Abstract: A shear thinning build material slurry includes metallic or ceramic particles having a particle size up to about 20 ?m; a hydrocolloid present in an amount ranging from about 0.05 percent by volume to less than 0.5 percent by volume of the shear thinning build material slurry; and water. The build material slurry is a ready-to-use three-dimensional (3D) printing build material.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: August 11, 2026
    Assignee: Peridot Print LLC
    Inventors: Thomas Craig Anthony, Ben Mint Pon, Hardik Rajesh Hingorani
  • HEAT EXCHANGERS
    Publication number: 20250244086
    Abstract: Examples of heat exchanger are described herein. In some examples, a heat exchanger may include a flow channel. In some examples, the heat exchanger may include a lattice structure disposed in the flow channel. In some examples, the heat exchanger may include a pipe structure embedded in the lattice structure. In some examples, an end of the pipe structure is disposed in a target region of the flow channel.
    Type: Application
    Filed: April 19, 2022
    Publication date: July 31, 2025
    Applicant: Peridot Print LLC
    Inventors: Wei HUANG, Ben Mint PON, Thomas Craig ANTHONY, Harish IRRINKI
  • SHEAR THINNING BUILD MATERIAL SLURRY
    Publication number: 20230278283
    Abstract: A shear thinning build material slurry includes metallic or ceramic particles having a particle size up to about 20 ?m; a hydrocolloid present in an amount ranging from about 0.05 percent by volume to less than 0.5 percent by volume of the shear thinning build material slurry; and water. The build material slurry is a ready-to-use three-dimensional (3D) printing build material.
    Type: Application
    Filed: June 25, 2020
    Publication date: September 7, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: THOMAS CRAIG ANTHONY, BEN MINT PON, HARDIK RAJESH HINGORANI