Patents by Inventor Ben Moore
Ben Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12375749Abstract: Systems and methods are disclosed for synchronization of independent services. In certain embodiments, a method may comprise generating output synchronized to a secondary service output, including obtaining a manifest of events corresponding to the secondary service output, generating a resource schedule of resources to call at specified timestamps based on the manifest, executing a selected resource when a corresponding timestamp is received, and providing an output from the selected resource.Type: GrantFiled: July 18, 2022Date of Patent: July 29, 2025Assignee: Atmosphere.tvInventor: Ben Moore
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Publication number: 20240022782Abstract: Systems and methods are disclosed for synchronization of independent services. In certain embodiments, a method may comprise generating output synchronized to a secondary service output, including obtaining a manifest of events corresponding to the secondary service output, generating a resource schedule of resources to call at specified timestamps based on the manifest, executing a selected resource when a corresponding timestamp is received, and providing an output from the selected resource.Type: ApplicationFiled: July 18, 2022Publication date: January 18, 2024Inventor: Ben Moore
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Publication number: 20230421838Abstract: Systems and methods are disclosed for dynamic content stream generation. In certain embodiments, a method may comprise executing a dynamic content stream generation system, including obtaining client details, selecting streaming video content based on the client details, and generating overlay data for the streaming video content based on the client details. The method may further comprise generating combined stream data incorporating the streaming video content and the overlay data, and displaying the combined stream data at a client device.Type: ApplicationFiled: June 23, 2022Publication date: December 28, 2023Inventors: Ben Moore, Zach Hobbs, Jeff DiTullio
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Patent number: 9473313Abstract: A system and method for dynamic provisioning is provided. In an embodiment, a provisioning engine receives data representing a device profile, a device state and a network state, and to the extent that the device profile, device state and network state are not consistent, the engine can dynamically re-provision the device to achieve an alternative provisioning.Type: GrantFiled: October 3, 2008Date of Patent: October 18, 2016Assignee: Redknee Inc.Inventors: Ben Moore, Vinay Kumar, Bohdan Zabawskyj
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Patent number: 8767689Abstract: Systems and methods for call routing are provided. Certain aspects disclose a system and method for call routing, where the call can originate from a hybrid mobile device capable of operating on either the traditional core mobile network or on a voice over Internet Protocol network. Regardless of which network is being accessed, the call can be routed to its intended destination. Other aspects disclose a system for providing a location of a hybrid mobile device.Type: GrantFiled: November 15, 2007Date of Patent: July 1, 2014Assignee: Redknee Inc.Inventors: Bohdan K. Zabawskyj, Ben Moore
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Patent number: 8626064Abstract: An interactive communication device, wherein the device is in communication with a second remotely located device, preferably through the use of high-speed wireless technology such as Bluetoothâ„¢, and wherein the instant invention is capable of sending and/or receiving a plurality of signals to and from the second remotely located device.Type: GrantFiled: November 19, 2008Date of Patent: January 7, 2014Inventor: Ben Moore
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Patent number: 8591665Abstract: Methods, systems, and computer programs are presented for processing a substrate in a processing chamber which includes a first chamber and a second chamber. A first surface of the substrate is exposed to the first chamber and a second surface of the substrate is exposed to the second chamber. One method includes an operation for applying a first fluid to the first surface of the substrate, where the first fluid is at a first temperature. Further, the method includes another operation for applying a second fluid to the second surface of the substrate, where the second fluid is at a second temperature. During processing of the substrate, the second temperature is higher than the first temperature, and the second fluid heats the substrate.Type: GrantFiled: October 31, 2012Date of Patent: November 26, 2013Assignee: Lam Research CorporationInventors: Ben Mooring, John Parks, Diane J. Hymes
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Publication number: 20130059260Abstract: Methods, systems, and computer programs are presented for processing a substrate in a processing chamber which includes a first chamber and a second chamber. A first surface of the substrate is exposed to the first chamber and a second surface of the substrate is exposed to the second chamber. One method includes an operation for applying a first fluid to the first surface of the substrate, where the first fluid is at a first temperature. Further, the method includes another operation for applying a second fluid to the second surface of the substrate, where the second fluid is at a second temperature. During processing of the substrate, the second temperature is higher than the first temperature, and the second fluid heats the substrate.Type: ApplicationFiled: October 31, 2012Publication date: March 7, 2013Inventors: Ben Mooring, John Parks, Diane J. Hymes
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Patent number: 8328942Abstract: In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first chamber and a second chamber. The apparatus further includes a first chamber inlet configured to input a first fluid of a first temperature into the first chamber at a first pressure and a second chamber inlet configured to input a second fluid of a second temperature into the second chamber at a second pressure wherein the first pressure and the second pressure are substantially equal. The second temperature is capable of being utilized to manage substrate temperature.Type: GrantFiled: December 17, 2004Date of Patent: December 11, 2012Assignee: Lam Research CorporationInventors: Ben Mooring, John Parks, Diane J. Hymes
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Patent number: 8135485Abstract: A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.Type: GrantFiled: September 24, 2008Date of Patent: March 13, 2012Assignee: Lam Research CorporationInventors: Jack Chen, Andrew D. Bailey, III, Ben Mooring, Stephen J Cain
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Publication number: 20120002646Abstract: Systems and methods for call routing are provided. Certain aspects disclose a system and method for call routing, where the call can originate from a hybrid mobile device capable of operating on either the traditional core mobile network or on a voice over Internet Protocol network. Regardless of which network is being accessed, the call can be routed to its intended destination. Other aspects disclose a system for providing a location of a hybrid mobile device.Type: ApplicationFiled: November 15, 2007Publication date: January 5, 2012Applicant: REDKNEE INC.Inventors: Bohdan K. Zabawskyj, Ben Moore
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Publication number: 20110269421Abstract: A system and method for dynamic provisioning is provided. In an embodiment, a provisioning engine receives data representing a device profile, a device state and a network state, and to the extent that the device profile, device state and network state are not consistent, the engine can dynamically re-provision the device to achieve an alternative provisioning.Type: ApplicationFiled: October 3, 2008Publication date: November 3, 2011Applicant: REDKNEE INC.Inventors: Ben Moore, Vinay Kumar, Philip Steele, Bohdan Zabawskyj
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Publication number: 20100124884Abstract: An interactive communication device, wherein the device is in communication with a second remotely located device, preferably through the use of high-speed wireless technology such as Bluetoothâ„¢, and wherein the instant invention is capable of sending and/or receiving a plurality of signals to and from the second remotely located device.Type: ApplicationFiled: November 19, 2008Publication date: May 20, 2010Inventor: Ben Moore
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Publication number: 20090088887Abstract: A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.Type: ApplicationFiled: September 24, 2008Publication date: April 2, 2009Inventors: Jack Chen, Andrew C. Bailey, III, Ben Mooring, Stephen J. Cain
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Patent number: 7486878Abstract: A bevel inspection module for capturing images of a substrate is provided. The module includes a rotational motor, which is attached to a substrate chuck and is configured to rotate the substrate chuck thereby allowing the substrate to revolve. The module further includes a camera and an optic enclosure, which is attached to the camera and is configured to rotate, enabling light to be directed toward the substrate. The camera is mounted from a camera mount, which is configured to enable the camera to rotate on a 180 degree plane allowing the camera to capture images of at least one of a top view, a bottom view, and a side view of the substrate. The module yet also includes a backlight arrangement, which is configured to provide illumination to the substrate, thereby enabling the camera to capture the images, which shows contrast between the substrate and a background.Type: GrantFiled: December 18, 2006Date of Patent: February 3, 2009Assignee: Lam Research CorporationInventors: Jack Chen, Andrew D Bailey, III, Ben Mooring, Stephen J. Cain
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Patent number: 7479236Abstract: A method for calculating a process center for a chuck in a processing chamber is provided. The method includes generating pre-processing and post-processing measurement data points, which is perform by measuring thickness of a film substrate at a set of orientations and a set of distances from a geometric center of the substrate. The method also includes comparing the pre-processing and post-processing measurement data points to calculate a set of etch depth numbers. The method further includes generating etch profiles for the set of orientations. The method yet also includes extrapolating a set of radiuses, which is associated with a first etch depth, from the etch profiles. The method yet further includes generating an off-centered plot, which is a graphical representation of the set of radiuses versus the set of orientations. The method more over includes calculating the process center by applying a curve-fitting equation to the off-centered plot.Type: GrantFiled: December 18, 2006Date of Patent: January 20, 2009Assignee: Lam Research CorporationInventors: Jack Chen, Andrew D Bailey, III, Ben Mooring, Stephen J. Cain
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Publication number: 20080081383Abstract: A method for calculating a process center for a chuck in a processing chamber is provided. The method includes generating pre-processing and post-processing measurement data points, which is perform by measuring thickness of a film substrate at a set of orientations and a set of distances from a geometric center of the substrate. The method also includes comparing the pre-processing and post-processing measurement data points to calculate a set of etch depth numbers. The method further includes generating etch profiles for the set of orientations. The method yet also includes extrapolating a set of radiuses, which is associated with a first etch depth, from the etch profiles. The method yet further includes generating an off-centered plot, which is a graphical representation of the set of radiuses versus the set of orientations. The method more over includes calculating the process center by applying a curve-fitting equation to the off-centered plot.Type: ApplicationFiled: December 18, 2006Publication date: April 3, 2008Inventors: Jack Chen, Andrew D. Bailey, Ben Mooring, Stephen J. Cain
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Publication number: 20080080845Abstract: A bevel inspection module for capturing images of a substrate is provided. The module includes a rotational motor, which is attached to a substrate chuck and is configured to rotate the substrate chuck thereby allowing the substrate to revolve. The module further includes a camera and an optic enclosure, which is attached to the camera and is configured to rotate, enabling light to be directed toward the substrate. The camera is mounted from a camera mount, which is configured to enable the camera to rotate on a 180 degree plane allowing the camera to capture images of at least one of a top view, a bottom view, and a side view of the substrate. The module yet also includes a backlight arrangement, which is configured to provide illumination to the substrate, thereby enabling the camera to capture the images, which shows contrast between the substrate and a background.Type: ApplicationFiled: December 18, 2006Publication date: April 3, 2008Inventors: Jack Chen, Andrew D. Bailey, Ben Mooring, Stephen J. Cain
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Publication number: 20060130762Abstract: In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first chamber and a second chamber. The apparatus further includes a first chamber inlet configured to input a first fluid of a first temperature into the first chamber at a first pressure and a second chamber inlet configured to input a second fluid of a second temperature into the second chamber at a second pressure wherein the first pressure and the second pressure are substantially equal. The second temperature is capable of being utilized to manage substrate temperature.Type: ApplicationFiled: December 17, 2004Publication date: June 22, 2006Applicant: Lam Research Corp.Inventors: Ben Mooring, John Parks, Diane Hymes
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Patent number: 6428394Abstract: A method and apparatus are disclosed for chemically-mechanically polishing and planarizing semiconductors. An apparatus includes first and second rollers connected by a tension belt. A polishing member is releasably attached to the first and second rollers. A method includes clamping a first portion of a continuous strip of polishing member to a first roller, clamping a second portion of the continuous strip to a second roller, applying a tension to the continuous strip and rotationally reciprocating the rollers while pressing a semiconductor wafer against the continuous strip.Type: GrantFiled: March 31, 2000Date of Patent: August 6, 2002Assignee: Lam Research CorporationInventors: Ben Mooring, Wilbur Krusell, Glenn Travis, Erik Engdahl