Patents by Inventor Ben Naim
Ben Naim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250255239Abstract: The present invention discloses a disease resistant cultivated basil plant and/or seed comprising a genomic sequence having an introgressed basil downy mildew (BDM) resistance or tolerance associated haplotype derived from Ocimum americanum. A method for producing the same is also disclosed.Type: ApplicationFiled: April 11, 2025Publication date: August 14, 2025Applicant: BAR-ILAN UNIVERSITYInventors: Yigal COHEN, Yariv BEN NAIM
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Publication number: 20250206843Abstract: The present invention provides binding molecules, in particular VHH antibodies (nanobodies), that recognize HER2 protein with high affinity and specificity. The present invention further provides pharmaceutical compositions comprising the binding molecules and methods for their use in treating cancer.Type: ApplicationFiled: April 2, 2023Publication date: June 26, 2025Inventors: Niv PAPO, Lital BEN NAIM
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Patent number: 12221695Abstract: A first and a second flange assembly configured for facilitating uniform and laminar flow in a system are provided. The first flange assembly includes a first flange body configured to introduce a gas into a chamber. The first flange assembly includes a plurality of outlet tubes disposed on an interior surface of the first flange body and a plurality of inlet tubes disposed on an exterior surface of the first flange body and in fluid communication with the plurality of outlet tubes. The second flange assembly includes a second flange body configured to remove the gas from the chamber. The second flange assembly includes a plurality of through holes extending from an interior surface to an exterior surface of the second flange body and a plurality of exit tubes extending from the exterior surface of the second flange body and in fluid communication with the plurality of through holes.Type: GrantFiled: July 1, 2021Date of Patent: February 11, 2025Assignees: MELLANOX TECHNOLOGIES, LTD., BAR-ILAN UNIVERSITY, RAMOT AT TEL-AVIV UNIVERSITY LTD., SIMTAL NANO-COATINGS LTDInventors: Elad Mentovich, Yaniv Rotem, Yaakov Gridish, Doron Naveh, Chen Stern, Yosi Ben-Naim, Ariel Ismach, Eran Bar-Rabi, Tal Kaufman
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Publication number: 20240415088Abstract: The present invention discloses a disease resistant cultivated basil plant and/or seed comprising a genomic sequence having an introgressed basil downy mildew (BDM) resistance or tolerance associated haplotype derived from Ocimum americanum. A method for producing the same is also disclosed.Type: ApplicationFiled: January 19, 2023Publication date: December 19, 2024Applicant: BAR-ILAN UNIVERSITYInventors: Yigal COHEN, Yariv BEN NAIM
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Patent number: 12163228Abstract: A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.Type: GrantFiled: July 1, 2021Date of Patent: December 10, 2024Assignees: MELLANOX TECHNOLOGIES, LTD., BAR-ILAN UNIVERSITY, RAMOT AT TEL-AVIV UNIVERSITY LTD., SIMTAL NANO-COATINGS LTDInventors: Elad Mentovich, Yaniv Rotem, Yaakov Gridish, Doron Naveh, Chen Stern, Yosi Ben-Naim, Ariel Ismach, Eran Bar-Rabi, Tal Kaufman
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GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEMENT WITHIN PRINTED CIRCUIT BOARDS
Publication number: 20240397604Abstract: Methods of forming a graphene integrated core for making a printed circuit board (PCB) having enhanced thermal management properties are disclosed. The methods include providing a core body having a core body length and applying a graphene multi-layer to the core body to form a laminated stack, where the graphene multi-layer has a graphene multi-layer length that is shorter than the core body length. At least one conductive layer may be applied to the laminated stack. The graphene multi-layer may be disposed within the graphene integrated core such that the graphene multi-layer is electrically insulated from the at least one conductive layer. Corresponding graphene integrated cores having a graphene multi-layer that is disposed within the graphene integrated core such that the graphene multi-layer is electrically insulated from the at least one conductive layer are also described.Type: ApplicationFiled: May 22, 2023Publication date: November 28, 2024Applicants: NVIDIA CORPORATION, BAR ILAN UNIVERSITYInventors: Oren STEINBERG, Elad MENTOVICH, Sima BUCHBINDER, Boaz ATIAS, Ori AZULAY, Yosi BEN-NAIM, Adi LEVI, Doron NAVEH, Elia Olga KRONGAUZ -
Publication number: 20240397636Abstract: Methods for integrating copper-graphene laminate (CGL) in a multilayer PCB fabrication process and the resulting lamination stacks are disclosed. The methods include providing a core and applying a first graphene layer to the surface of the core. The methods further include applying a metal layer to the first graphene layer and applying a second graphene layer to the metal layer. Further, the methods include applying a photoresist layer to the second graphene layer and applying a protective layer to the photoresist layer. In some embodiments, the methods include applying a metallic plating to lamination stack. The methods further include drilling through the protective layer and at least one of a photoresist layer, the second graphene layer, the metal layer, the first graphene layer, and/or the core.Type: ApplicationFiled: May 22, 2023Publication date: November 28, 2024Applicants: NVIDIA CORPORATION, BAR ILAN UNIVERSITYInventors: Oren STEINBERG, Elad MENTOVICH, Sima BUCHBINDER, Boaz ATIAS, Eyal SHOHAM, Adi LEVI, Yosi BEN-NAIM, Doron NAVEH, Ori AZULAY
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Patent number: 12004308Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.Type: GrantFiled: July 1, 2021Date of Patent: June 4, 2024Assignees: Mellanox Technologies, Ltd., BAR-ILAN University, PCB Technologies LtdInventors: Boaz Atias, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp
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Patent number: 11963309Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.Type: GrantFiled: July 1, 2021Date of Patent: April 16, 2024Assignees: MELLANOX TECHNOLOGIES, LTD., BAR-ILAN UNIVERSITY, PCB TECHNOLOGIES LTD.Inventors: Boaz Atias, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp, Alon Rubinstein, Ran Hasson Ruso
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Publication number: 20240093225Abstract: The present invention relates to isolated and recombinant polynucleotides encoding polypeptides having insecticidal activity and to host cells comprising same. The invention further relates to the use of the insecticidal proteins and/or nucleic acid sequences encoding same for killing or inhibiting the development of insect pests as well as for conferring insect resistance to plants. The invention further provides compositions comprising the pesticidal polypeptides and/or polynucleotide encoding same and host cells, particularly bacterial cells, expressing the insecticidal polypeptides.Type: ApplicationFiled: November 17, 2023Publication date: March 21, 2024Applicant: EVOGENE LTDInventors: Or ROTEM, Moshe ELBAZ, Michal SIMOVITCH ETKES, Lisa N. MEIHLS, Noam BEN NAIM, Dhritiman Ghosh
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Patent number: 11859197Abstract: The present invention relates to isolated and recombinant polynucleotides encoding polypeptides having insecticidal activity and to host cells comprising same. The invention further relates to the use of the insecticidal proteins and/or nucleic acid sequences encoding same for killing or inhibiting the development of insect pests as well as for conferring insect resistance to plants. The invention further provides compositions comprising the pesticidal polypeptides and/or polynucleotide encoding same and host cells, particularly bacterial cells, expressing the insecticidal polypeptides.Type: GrantFiled: May 2, 2019Date of Patent: January 2, 2024Assignee: EVOGENE LTD.Inventors: Or Rotem, Moshe Elbaz, Michal Simovitch Etkes, Lisa N. Meihls, Noam Ben Naim, Dhritiman Ghosh
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Publication number: 20230007788Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.Type: ApplicationFiled: July 1, 2021Publication date: January 5, 2023Inventors: Boaz ATIAS, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp, Alon Rubinsten
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Publication number: 20230002906Abstract: A continuous-feed chemical vapor deposition system and an associated method are provided. An example of the continuous-feed chemical vapor deposition system includes a first chamber configured to receive a substrate. The continuous-feed chemical vapor deposition system includes a second chamber downstream from the first chamber and configured to receive the substrate from the first chamber. The second chamber is configured to perform a chemical vapor deposition process on the substrate. The continuous-feed chemical vapor deposition system includes a third chamber downstream from the second chamber that is configured to receive the substrate from the second chamber upon completion of the chemical vapor deposition process. The second chamber can be environmentally isolated from the first chamber and the third chamber. The first chamber is further configured to receive a subsequent substrate when the chemical vapor deposition process is occurring in the second chamber.Type: ApplicationFiled: July 1, 2021Publication date: January 5, 2023Inventors: Elad MENTOVICH, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20220372622Abstract: A first and a second flange assembly configured for facilitating uniform and laminar flow in a system are provided. The first flange assembly includes a first flange body configured to introduce a gas into a chamber. The first flange assembly includes a plurality of outlet tubes disposed on an interior surface of the first flange body and a plurality of inlet tubes disposed on an exterior surface of the first flange body and in fluid communication with the plurality of outlet tubes. The second flange assembly includes a second flange body configured to remove the gas from the chamber. The second flange assembly includes a plurality of through holes extending from an interior surface to an exterior surface of the second flange body and a plurality of exit tubes extending from the exterior surface of the second flange body and in fluid communication with the plurality of through holes.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Elad Mentovich, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20220372621Abstract: A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Elad MENTOVICH, Yaniv ROTEM, Yaakov GRIDISH, Doron NAVEH, Chen STERN, Yosi BEN-NAIM, Ariel ISMACH, Eran BAR-RABI, Tal KAUFMAN
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Publication number: 20220377912Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.Type: ApplicationFiled: July 1, 2021Publication date: November 24, 2022Inventors: Boaz ATIAS, Elad MENTOVICH, Yaniv ROTEM, Doron NAVEH, Adi LEVI, Yosi BEN-NAIM, Yaad ELIYA, Shlomo DANINO, Eran LIPP
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Patent number: 11223480Abstract: Systems and methods are provided for identifying potentially compromised cloud-based access information. The systems and methods include providing a unique signature for insertion into application programming interface (API) communications to be sent from a network resource to a cloud application executable in a cloud environment. The unique signature can be associated with an access token that a particular identity can use to request access to the cloud application. The systems and methods include accessing a log associated with the cloud environment, identifying the unique signature and the access token using information in the log, accessing a trusted validation resource storing signature information associated with the access token, determining whether the unique signature is valid, and determining whether the access token is potentially compromised.Type: GrantFiled: January 2, 2018Date of Patent: January 11, 2022Assignee: CyberArk Software Ltd.Inventors: Asaf Hecht, Kobi Ben Naim
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Publication number: 20210171976Abstract: The present invention relates to isolated and recombinant polynucleotides encoding polypeptides having insecticidal activity and to host cells comprising same. The invention further relates to the use of the insecticidal proteins and/or nucleic acid sequences encoding same for killing or inhibiting the development of insect pests as well as for conferring insect resistance to plants. The invention further provides compositions comprising the pesticidal polypeptides and/or polynucleotide encoding same and host cells, particularly bacterial cells, expressing the insecticidal polypeptides.Type: ApplicationFiled: May 2, 2019Publication date: June 10, 2021Inventors: Or ROTEM, Moshe ELBAZ, Michal SIMOVITCH ETKES, Lisa N. MEIHLS, Noam BEN NAIM, Dhritiman GHOSH
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Patent number: 10931701Abstract: Disclosed embodiments relate to systems and methods for automatically and transparently detecting potential compromises or unauthorized use of endpoint computing devices. Techniques include engaging, at a security server, in an agentless management session with an application running on an endpoint computing device; controlling, at the security server and through the agentless management session, a user-facing session of the application; receiving, at the security server, an indication of anomalous activity or loss of a proximity between at least one of: the one or more personal computing devices associated with the user and the endpoint computing device, or the one or more personal computing devices associated with the user and the user; and implementing a control action in the agentless management session, based on the received indication.Type: GrantFiled: July 8, 2020Date of Patent: February 23, 2021Assignee: CyberArk Software Ltd.Inventors: Ido Hoorvitch, Yaacov Ben Naim
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Publication number: 20210021625Abstract: Disclosed embodiments relate to systems and methods for automatically and transparently detecting potential compromises or unauthorized use of endpoint computing devices. Techniques include engaging, at a security server, in an agentless management session with an application running on an endpoint computing device; controlling, at the security server and through the agentless management session, a user-facing session of the application; receiving, at the security server, an indication of anomalous activity or loss of a proximity between at least one of: the one or more personal computing devices associated with the user and the endpoint computing device, or the one or more personal computing devices associated with the user and the user; and implementing a control action in the agentless management session, based on the received indication.Type: ApplicationFiled: July 8, 2020Publication date: January 21, 2021Applicant: CyberArk Software Ltd.Inventors: Ido Hoorvitch, Yaacov Ben Naim