Patents by Inventor Ben P. Fok

Ben P. Fok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Unattached contained semiconductor devices
    Patent number: 8436433
    Abstract: An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: May 7, 2013
    Assignee: Rosemount Aerospace Inc.
    Inventors: Scott D. Isebrand, Nghia T. Dinh, Andrew S. Paule, Ben P. Fok
  • UNATTACHED CONTAINED SEMICONDUCTOR DEVICES
    Publication number: 20130093030
    Abstract: An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.
    Type: Application
    Filed: October 13, 2011
    Publication date: April 18, 2013
    Applicant: Rosemount Aerospace Inc.
    Inventors: Scott D. Isebrand, Nghia T. Dinh, Andrew S. Paule, Ben P. Fok