Patents by Inventor Ben R. Hollis

Ben R. Hollis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4286542
    Abstract: Apparatus is disclosed for immersing minute integrated circuit chips in an etching solution in manufacturing integrated circuits during research and development. The apparatus includes holder member C having a handle 24 and basket support 26 for carrying a removable unitary basket A and lid structure B wherein fluid flow-through passages 20 are formed and wherein graduated openings 28 in the handle provide for adjustably supporting the basket in a beaker at a desired level.
    Type: Grant
    Filed: July 18, 1980
    Date of Patent: September 1, 1981
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Jewell G. Belcher, Jr., Ben R. Hollis, Jr.
  • Patent number: 4156309
    Abstract: The method of constructing a high voltage, low power, multi-cell solar array wherein a solar cell base region is formed in a substrate such as but not limited to that of silicon or on a substrate of sapphire, and then by the steps of application of a protective coating on the base, patterned etching of the coating and base to thereby form discrete base regions, forming a semi-conductive junction and upper active region in each base region defined by photolithography, and thus forming discrete cells which are interconnected by metallic electrodes.
    Type: Grant
    Filed: December 23, 1977
    Date of Patent: May 29, 1979
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Donald E. Routh, Ben R. Hollis, William R. Feltner
  • Patent number: 4111775
    Abstract: An improved method of constructing a metal oxide semiconductor (MOS) device having multiple layers of metal deposited by D.C. magnetron sputtering at low D.C. voltages and low substrate temperatures provides multilevel interconnections and cross over between individual circuit elements in integrated circuits without significantly reducing the reliability or seriously affecting the yield.
    Type: Grant
    Filed: July 8, 1977
    Date of Patent: September 5, 1978
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Ben R. Hollis, Jr., William R. Feltner, David L. Bouldin, Donald E. Routh