Patents by Inventor Ben SAMPLES

Ben SAMPLES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power Package Configured for Increased Power Density, Electrical Efficiency, and Thermal Performance
    Publication number: 20260096415
    Abstract: A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and/or at least one routing layer on the at least one power substrate.
    Type: Application
    Filed: September 27, 2024
    Publication date: April 2, 2026
    Inventors: Shashwat Singh, Brice McPherson, Brandon Passmore, Ben Samples, Sayan Seal, Roberto Marcelo Schupbach
  • Power module having electrical interconnections using mechanical fittings and process of implementing the same
    Patent number: 12322886
    Abstract: A power module includes at least one power substrate; a plurality of power devices arranged on the at least one power substrate; and a power connector configured to be electrically connected to the plurality of power devices. The power connector includes a mechanically compliant fitting.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: June 3, 2025
    Assignee: Wolfspeed, Inc.
    Inventors: Ben Samples, Zach Cole, Amol Deshpande
  • POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
    Publication number: 20250014973
    Abstract: A device includes a power substrate and a first power device on the power substrate. A housing having housing sides having at least a first housing side and a second housing side, the housing configured to house at least the power substrate and the first power device. A plurality of power terminals extending from at least one of the housing sides. The plurality of power terminals having at least a first power terminal and a second power terminal. A plurality of signal terminals extending from at least one of the housing sides. The plurality of signal terminals having at least a source kelvin signal terminal, a gate driver signal terminal, and at least one additional signal terminal.
    Type: Application
    Filed: July 3, 2023
    Publication date: January 9, 2025
    Inventors: Paul WHEELER, Brice MCPHERSON, Roberto Marcelo SCHUPBACH, Leonardo MONTOYA, Brandon PASSMORE, Mohammad Hazzaz MAHMUD, Ben SAMPLES, Prasana Obala BHUVANESH, Ajit R. KANALE
  • POWER MODULE HAVING ELECTRICAL INTERCONNECTIONS USING MECHANICAL FITTINGS AND PROCESS OF IMPLEMENTING THE SAME
    Publication number: 20220328990
    Abstract: A power module includes at least one power substrate; a plurality of power devices arranged on the at least one power substrate; and a power connector configured to be electrically connected to the plurality of power devices. The power connector includes a mechanically compliant fitting.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 13, 2022
    Inventors: Ben SAMPLES, Zach COLE, Amol DESHPANDE