Patents by Inventor Ben Wayne Hicks

Ben Wayne Hicks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6641913
    Abstract: A multilayer polyolefin film of the type suitable for packaging application in which heat seals are formed, and in its preparation the multilayer film comprises a flexible substrate layer formed of a crystalline thermoplastic polymer having an interface surface. A heat-sealable surface layer is bonded to the interface surface of the substrate layer and is formed of a syndiotactic propylene polymer effective to produce a heat seal with itself at a sealing temperature of less than 110° C. The surface layer has a thickness which is less than the thickness of the substrate layer. The heat-seal layer can be formed of syndiotactic polypropylene polymerized in the presence of a syndiospecific metallocene catalyst and having a melt flow index of less than 2 grams/10 minutes. The multilayer film can take the form of a a biaxially-oriented film.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: November 4, 2003
    Assignee: Fina Technology, Inc.
    Inventors: Aiko Hanyu, Ben Wayne Hicks