Patents by Inventor Benben Li
Benben Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11763889Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: GrantFiled: March 28, 2022Date of Patent: September 19, 2023Assignee: Micron Technology, Inc.Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Patent number: 11569258Abstract: Some embodiments include a method of forming stacked memory decks. A first deck has first memory cells arranged in first tiers disposed one atop another, and has a first channel-material pillar extending through the first tiers. An inter-deck structure is over the first deck. The inter-deck structure includes an insulative expanse, and a region extending through the insulative expanse and directly over the first channel-material pillar. The region includes an etch-stop structure. A second deck is formed over the inter-deck structure. The second deck has second memory cells arranged in second tiers disposed one atop another. An opening is formed to extend through the second tiers and to the etch-stop structure. The opening is subsequently extended through the etch-stop structure. A second channel-material pillar is formed within the opening and is coupled to the first channel-material pillar. Some embodiments include integrated assemblies.Type: GrantFiled: July 20, 2020Date of Patent: January 31, 2023Assignee: Micron Technology, Inc.Inventors: Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik, Jordan D. Greenlee, Minsoo Lee, Benben Li
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Publication number: 20220284959Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: ApplicationFiled: March 28, 2022Publication date: September 8, 2022Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Patent number: 11289163Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: GrantFiled: November 2, 2020Date of Patent: March 29, 2022Assignee: Micron Technology, Inc.Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Publication number: 20210118508Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: ApplicationFiled: November 2, 2020Publication date: April 22, 2021Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Publication number: 20200350333Abstract: Some embodiments include a method of forming stacked memory decks. A first deck has first memory cells arranged in first tiers disposed one atop another, and has a first channel-material pillar extending through the first tiers. An inter-deck structure is over the first deck. The inter-deck structure includes an insulative expanse, and a region extending through the insulative expanse and directly over the first channel-material pillar. The region includes an etch-stop structure. A second deck is formed over the inter-deck structure. The second deck has second memory cells arranged in second tiers disposed one atop another. An opening is formed to extend through the second tiers and to the etch-stop structure. The opening is subsequently extended through the etch-stop structure. A second channel-material pillar is formed within the opening and is coupled to the first channel-material pillar. Some embodiments include integrated assemblies.Type: ApplicationFiled: July 20, 2020Publication date: November 5, 2020Applicant: Micron Technology, Inc.Inventors: Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik, Jordan D. Greenlee, Minsoo Lee, Benben Li
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Patent number: 10825523Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: GrantFiled: October 29, 2019Date of Patent: November 3, 2020Assignee: Micron Technology, Inc.Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Patent number: 10748921Abstract: Some embodiments include a method of forming stacked memory decks. A first deck has first memory cells arranged in first tiers disposed one atop another, and has a first channel-material pillar extending through the first tiers. An inter-deck structure is over the first deck. The inter-deck structure includes an insulative expanse, and a region extending through the insulative expanse and directly over the first channel-material pillar. The region includes an etch-stop structure. A second deck is formed over the inter-deck structure. The second deck has second memory cells arranged in second tiers disposed one atop another. An opening is formed to extend through the second tiers and to the etch-stop structure. The opening is subsequently extended through the etch-stop structure. A second channel-material pillar is formed within the opening and is coupled to the first channel-material pillar. Some embodiments include integrated assemblies.Type: GrantFiled: October 25, 2018Date of Patent: August 18, 2020Assignee: Micron Technology, Inc.Inventors: Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik, Jordan D. Greenlee, Minsoo Lee, Benben Li
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Publication number: 20200135751Abstract: Some embodiments include a method of forming stacked memory decks. A first deck has first memory cells arranged in first tiers disposed one atop another, and has a first channel-material pillar extending through the first tiers. An inter-deck structure is over the first deck. The inter-deck structure includes an insulative expanse, and a region extending through the insulative expanse and directly over the first channel-material pillar. The region includes an etch-stop structure. A second deck is formed over the inter-deck structure. The second deck has second memory cells arranged in second tiers disposed one atop another. An opening is formed to extend through the second tiers and to the etch-stop structure. The opening is subsequently extended through the etch-stop structure. A second channel-material pillar is formed within the opening and is coupled to the first channel-material pillar. Some embodiments include integrated assemblies.Type: ApplicationFiled: October 25, 2018Publication date: April 30, 2020Applicant: Micron Technology, Inc.Inventors: Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik, Jordan D. Greenlee, Minsoo Lee, Benben Li
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Publication number: 20200066346Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Patent number: 10475515Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: GrantFiled: December 21, 2017Date of Patent: November 12, 2019Assignee: Micron Technology, Inc.Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Publication number: 20190198109Abstract: Some embodiments include apparatuses and methods of forming such apparatuses. One of the apparatus includes first memory cells located in different levels in a first portion of the apparatus, second memory cells located in different levels in a second portion of the apparatus, a switch located in a third portion of the apparatus between the first and second portions, first and second control gates to access the first and second memory cells, an additional control gate located between the first and second control gates to control the switch, a first conductive structure having a thickness and extending perpendicular to the levels in the first portion of the apparatus, a first dielectric structure between the first conductive structure and charge-storage portions of the first memory cells, a second dielectric structure having a second thickness between the second conductive structure and a sidewall of the additional control gate, the second thickness being greater than the first thickness.Type: ApplicationFiled: December 21, 2017Publication date: June 27, 2019Inventors: Benben Li, Akira Goda, Ramey M. Abdelrahaman, Ian C. Laboriante, Krishna K. Parat
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Patent number: 9412821Abstract: A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.Type: GrantFiled: November 5, 2015Date of Patent: August 9, 2016Assignee: Intel CorporationInventors: Fatma Arzum Simsek-Ege, Jie Jason Sun, Benben Li, Srikant Jayanti, Han Zhao, Guangyu Huang, Haitao Liu
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Publication number: 20160126311Abstract: A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.Type: ApplicationFiled: November 5, 2015Publication date: May 5, 2016Applicant: Intel CorporationInventors: Fatma Arzum Simsek-Ege, Jie Jason Sun, Benben Li, Srikant Jayanti, Han Zhao, Guangyu Huang, Haitao Liu
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Patent number: 9330877Abstract: Logic devices are provided in multiple sub-collector and sub-emitter microplasma devices formed in thin and flexible, or inflexible, semiconductor materials. Logic operations are provided with one of a plurality of microplasmas forming sub-collectors with a common emitter, or a common collector plasma with a plurality of sub-emitter regions in a solid state semi-conductor pn-junction, and generating a logic output from an electrode, based upon electrode inputs to two other electrodes.Type: GrantFiled: June 1, 2015Date of Patent: May 3, 2016Assignee: The Board of Trustees of the University of IllinoisInventors: J. Gary Eden, Paul A. Tchertchian, Clark J. Wagner, Dane J. Sievers, Thomas J. Houlahan, Benben Li
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Patent number: 9263558Abstract: A hybrid plasma semiconductor device has a thin and flexible semiconductor base layer. An emitter region is diffused into the base layer forming a pn-junction. An insulator layer is upon one side the base layer and emitter region. Base and emitter electrodes are isolated from each other by the insulator layer and electrically contact the base layer and emitter region through the insulator layer. A thin and flexible collector layer is upon an opposite side of the base layer. A microcavity is formed in the collector layer and is aligned with the emitter region. Collector electrodes are arranged to sustain a microplasma within the microcavity with application of voltage to the collector electrodes. A depth of the emitter region and a thickness of the base layer are set to define a predetermined thin portion of the base layer as a base region between the emitter region and the microcavity. Microplasma generated in the microcavity serves as a collector.Type: GrantFiled: August 5, 2014Date of Patent: February 16, 2016Assignee: The Board of Trustees of the University of IllinoisInventors: J. Gary Eden, Paul A. Tchertchian, Clark J. Wagner, Dane J. Sievers, Thomas J. Houlahan, Benben Li
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Patent number: 9209199Abstract: A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.Type: GrantFiled: March 21, 2014Date of Patent: December 8, 2015Assignee: Intel CorporationInventors: Fatma Arzum Simsek-Ege, Jie Jason Sun, Benben Li, Srikant Jayanti, Han Zhao, Guangyu Huang, Haitao Liu
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Patent number: 9184341Abstract: Preferred embodiment flexible and on wafer hybrid plasma semiconductor devices have at least one active solid state semiconductor region; and a plasma generated in proximity to the active solid state semiconductor region(s). A preferred device is a hybrid plasma semiconductor device having base, emitting and microcavity collector regions formed on a single side of a device layer. Visible or ultraviolet light is emitted during operation by plasma collectors in the array. In preferred embodiments, individual PBJTs in the array serve as sub-pixels of a full-color display.Type: GrantFiled: July 14, 2014Date of Patent: November 10, 2015Assignee: The Board of Trustees of the University of IllinoisInventors: J. Gary Eden, Paul A. Tchertchian, Clark J. Wagner, Dane J. Sievers, Thomas J. Houlahan, Benben Li
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Publication number: 20150294831Abstract: Logic devices are provided in multiple sub-collector and sub-emitter microplasma devices formed in thin and flexible, or inflexible, semiconductor materials. Logic operations are provided with one of a plurality of microplasmas forming sub-collectors with a common emitter, or a common collector plasma with a plurality of sub-emitter regions in a solid state semi-conductor pn-junction, and generating a logic output from an electrode, based upon electrode inputs to two other electrodes.Type: ApplicationFiled: June 1, 2015Publication date: October 15, 2015Inventors: J. Gary Eden, Paul A. Tchertchian, Clark J. Wagner, Dane J. Sievers, Thomas J. Houlahan, Benben Li
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Publication number: 20150270280Abstract: A hollow-channel memory device comprises a source layer, a first hollow-channel pillar structure formed on the source layer, and a second hollow-channel pillar structure formed on the first hollow-channel pillar structure. The first hollow-channel pillar structure comprises a first thin channel and the second hollow-channel pillar structure comprises a second thin channel that is in contact with the first thin channel. In one exemplary embodiment, the first thin channel comprises a first level of doping; and the second thin channel comprises a second level of doping that is different from the first level of doping. In another exemplary embodiment, the first and second levels of doping are the same.Type: ApplicationFiled: March 21, 2014Publication date: September 24, 2015Inventors: Fatma Arzum Simsek-Ege, Jie Jason Sun, Benben Li, Srikant Jayanti