Patents by Inventor BENEDICT C. OFUONYE

BENEDICT C. OFUONYE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processor and chipset continuity testing of package interconnect for functional safety applications
    Patent number: 11486942
    Abstract: Methods and apparatus relating to processor and chipset continuity testing of package interconnect for functional safety applications are described. In an embodiment, voltage divider logic circuitry divides a reference voltage. Controller logic circuitry compares a divided voltage value from a node of the voltage divider logic circuitry and a threshold voltage value. A first end of the voltage divider logic circuitry is coupled to receive the reference voltage and a second end of the voltage divider logic circuitry is coupled to a Non-Critical-To-Function (NCTF) solder ball. The controller logic circuitry generates an error signal in response to a mismatch between the divided voltage value and the threshold voltage value. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: November 1, 2022
    Assignee: Intel Corporation
    Inventors: Matthew Lee, Benedict C. Ofuonye, Erich Ewy, Jeffrey Willcoxon
  • PROCESSOR AND CHIPSET CONTINUITY TESTING OF PACKAGE INTERCONNECT FOR FUNCTIONAL SAFETY APPLICATIONS
    Publication number: 20210286022
    Abstract: Methods and apparatus relating to processor and chipset continuity testing of package interconnect for functional safety applications are described. In an embodiment, voltage divider logic circuitry divides a reference voltage. Controller logic circuitry compares a divided voltage value from a node of the voltage divider logic circuitry and a threshold voltage value. A first end of the voltage divider logic circuitry is coupled to receive the reference voltage and a second end of the voltage divider logic circuitry is coupled to a Non-Critical-To-Function (NCTF) solder ball. The controller logic circuitry generates an error signal in response to a mismatch between the divided voltage value and the threshold voltage value. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: May 31, 2021
    Publication date: September 16, 2021
    Applicant: Intel Corporation
    Inventors: MATTHEW LEE, BENEDICT C. OFUONYE, ERICH EWY, JEFFREY WILLCOXON
  • Processor and chipset continuity testing of package interconnect for functional safety applications
    Patent number: 11022657
    Abstract: Methods and apparatus relating to processor and chipset continuity testing of package interconnect for functional safety applications are described. In an embodiment, voltage divider logic circuitry divides a reference voltage. Controller logic circuitry compares a divided voltage value from a node of the voltage divider logic circuitry and a threshold voltage value. A first end of the voltage divider logic circuitry is coupled to receive the reference voltage and a second end of the voltage divider logic circuitry is coupled to a Non-Critical-To-Function (NCTF) solder ball. The controller logic circuitry generates an error signal in response to a mismatch between the divided voltage value and the threshold voltage value. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: June 1, 2021
    Assignee: Intel Corporation
    Inventors: Matthew Lee, Benedict C. Ofuonye, Erich Ewy, Jeffrey Willcoxon
  • PROCESSOR AND CHIPSET CONTINUITY TESTING OF PACKAGE INTERCONNECT FOR FUNCTIONAL SAFETY APPLICATIONS
    Publication number: 20190049510
    Abstract: Methods and apparatus relating to processor and chipset continuity testing of package interconnect for functional safety applications are described. In an embodiment, voltage divider logic circuitry divides a reference voltage. Controller logic circuitry compares a divided voltage value from a node of the voltage divider logic circuitry and a threshold voltage value. A first end of the voltage divider logic circuitry is coupled to receive the reference voltage and a second end of the voltage divider logic circuitry is coupled to a Non-Critical-To-Function (NCTF) solder ball. The controller logic circuitry generates an error signal in response to a mismatch between the divided voltage value and the threshold voltage value. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 27, 2018
    Publication date: February 14, 2019
    Applicant: Intel Corporation
    Inventors: MATTHEW LEE, BENEDICT C. OFUONYE, ERICH EWY, JEFFREY WILLCOXON