Abstract: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

Abstract: A system for determining a degree of contamination of production units of a production line for the printing, equipping and reflow soldering of printed circuit boards, and evaluation unit.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.

Abstract: A system for determining a degree of contamination of production units of a production line for the printing, equipping and reflow soldering of printed circuit boards, and evaluation unit.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel including a preheating zone, a soldering zone and a cooling zone, having fan units for circulating process gas in the process channel, wherein the fan units each comprise an electric fan motor and a fan wheel, and having at least one apparatus element, wherein the soldering apparatus can be operated in an operating mode in which the fan motors are controlled in such a way that they are operated at a constant or largely constant rotational speed, as a result of which process gas is conducted through the at least one apparatus element and is then drawn in again by the respective fan units.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.

Abstract: Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.

Abstract: A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

Abstract: Center support for supporting solder material during the transport along a transport direction through a soldering system, transport unit, and soldering system having such a center support.

Abstract: The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood.