Abstract: A zero-insertion force interconnect system. The interconnect system comprises at least two substantially parallel printed circuit boards on which electronic components are mounted. The printed circuit boards are held in place by a flexible U-shaped member running along one edge of each board. The U-shaped member includes a plurality of parallel electrical contacts, extending from either one of the printed circuit boards. The parallel electrical contacts are covered by insulator material with the exception of one small portion on each electrical contact. This exposed portion is mated with a mother board, which has a configuration of electrical contacts that matches the configuration of the U-shaped member. A resilient member is located behind the electrical contacts of the U-shaped member to provide wiping action between the contacts of the U-shaped member and the contacts of the mother board when the two units are brought together.