Patents by Inventor Benedicto delos Santos

Benedicto delos Santos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TIRE AND TIRE SENSOR
    Publication number: 20230008775
    Abstract: In an example, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module includes a detector patch that includes one or more capacitors, each of which has an electrostatic capacity that is variable due to at least deformation of each capacitor. The sensor module also includes an electronics unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to an inside of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inside of the at least one of the tread portion or the sidewall portion. The electronics unit is configured to estimate at least one of the parameters based on the electrostatic capacity of each capacitor.
    Type: Application
    Filed: February 19, 2021
    Publication date: January 12, 2023
    Inventors: Toshihiko OMOTE, Benedicto DELOS SANTOS, Martin John MCCASLIN, John BORTELL, Sean SOUSA, Colton Allen OTTLEY, Jared K. JONAS, Colin D. EICHINGER, Nathan C. BRIGGS
  • B-stageable die attach adhesives
    Patent number: 7851254
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: December 14, 2010
    Assignee: Henkel Corporation
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • Interlayer dielectric and pre-applied die attach adhesive materials
    Patent number: 7550825
    Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: June 23, 2009
    Assignee: Henkel Corporation
    Inventors: Benedicto delos Santos, James T. Huneke, Puwei Liu, Kang Yang, Qing Ji
  • B-STAGEABLE DIE ATTACH ADHESIVES
    Publication number: 20080160315
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: February 9, 2007
    Publication date: July 3, 2008
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • Interlayer dielectric and pre-applied die attach adhesive materials
    Patent number: 7312534
    Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: December 25, 2007
    Assignee: Henkel Corporation
    Inventors: Benedicto delos Santos, James T. Huneke, Puwei Liu, Kang Yang, Qing Ji
  • B-stageable die attach adhesives
    Patent number: 7176044
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: February 13, 2007
    Assignee: Henkel Corporation
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • B-stageable die attach adhesives
    Publication number: 20040102566
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: June 12, 2003
    Publication date: May 27, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos