Abstract: A self-aligning electrical connector system for data and/or energy transmission includes first and second connector parts and a support frame. The first connector part includes positioning pins, flat elements, and a ball socket positioned between the flat elements. The second connector part is attachable to the first connector part and includes positioning chambers engageable with the positioning pins to achieve a coarse positioning of the connector parts relative to one another. The support frame has a flat central bar including spring arms. A ball is supported by the ball socket. The first connector part is supported on the support frame by spring forces of the spring arms acting on the flat elements and is supported on the ball with the ball being rollable on the central bar whereby the first connector part is floatingly arranged on the support frame and is shiftable and tiltable relative to the support frame.

Abstract: The invention relates to a clamping holder as well as to a pane assembly comprising such a clamping holder and to a method for producing such a pane assembly. Pane assemblies, which are injection molded on the edge side by a frame section, are known in the state of the art. In response to the production of the pane assembly, a retaining strip, which is embedded into the frame section through this after the injection molding process, is furthermore inserted into the injection molding tool. A retaining clamp, by means of which trim can be attached to the pane assembly in a clamping manner, must be attached to the retaining strip after the completion of the pane assembly. To avoid the requirement of subsequently attaching a retaining clamp, provision is made for a clamping holder comprising a connecting section and a clamp section, which is embodied such that connecting section and clamp section can together be inserted into an injection molding tool.

Abstract: An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.

Abstract: A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.

Abstract: A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.

Abstract: An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.

Abstract: A cooling device has a cooling element (3) and a pressing device (4) which presses the component (1) against the cooling element (3). The pressing device (4) is resilient and is connected to the cooling element in a positive fit in order to produce fixing means which fix the component (1) to the cooling element in a reliable manner, the fixing means being easy to produce and compact.

Abstract: A semiconductor power module has a support (1), whereon are formed conductor strips (5, 6, 7, 8) by applying a structure on an electrically conductive layer (3) applied on one side (2) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by using a homogeneous base support. Therefore, the conductor strips (5, 6, 7, 8), as integral elements of the conductor circuit have loose ends (6a, 7a, 8a) detached from the side (2) of the support, the ends of the conductor strips extending outside the support (1) and forming external connections.