Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.

Abstract: Described herein is a method and structure for fabricating a self-sensing piezoelectric actuator. In a single device, the actuator may be formed which is capable of movement, along with a sensor that may provide a signal indicative of the speed and/or magnitude of the movement. The actuator may be fabricated on one wafer, and the sensor fabricated on a second wafer, and the two wafers bonded together to form the device. The device may be appropriate for vibration devices such as ultrasound tranducers and the like. The structure may be fabricated using well known semiconductor techniques such as depositions, etching and ion implantation.

Abstract: A microfabricated fluid pump is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied. The force may be provided by an embedded layer of piezoelectric material. Embedded strain gauges may allow self-sensing and convenient, precise operational control.

Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.

Abstract: A MEMS device, having two flexible, permeable members which are manufactured to have sub-millimeter dimensions using MEMS fabrication procedures. The flexible, permeable members may form a reed switch, which closes an electrical connection in the presence of a magnetic field, and opens the connection otherwise. The MEMS reed switch device may be made using a three-wafer architecture of a lid wafer, a device wafer, and a lower, supporting wafer.

Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.

Abstract: A first ion rich dielectric substrate with a patterned dielectric barrier and a oxidizable metal layer is anodically bonded to a second ion rich dielectric substrate. To bond the substrates, the oxidizable metal layer is oxidized. The dielectric barrier may inhibit the migration of these ions to the bondline, which might otherwise poison the bond strength. Accordingly, when joining the two substrates, a strong bond is maintained between the wafers.

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract: A microfabricated magnetic field transducer uses a magnetically sensitive structure in combination with one or more permeable magnetic flux guides. The flux guides may route off-axis components of an externally applied magnetic field across the sensitive axis of the magnetically sensitive structure, or may shield the magnetically sensitive structure from off-axis, stray fields or noise sources. A combination of flux guides and magnetically sensitive structures arranged on a single substrate may enable an integrated, 3-axis magnetometer in a single package, greatly improving cost and performance.

Abstract: A method for forming a cavity in a microfabricated structure, includes the sealing of that cavity with a low temperature solder. The method may include forming a sacrificial layer over a substrate, forming a flexible membrane over the sacrificial layer, forming a release hole through a flexible membrane to the sacrificial layer, introducing an etchant through the release hole to remove the sacrificial layer, and then sealing that release hole with a low temperature solder.

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.

Abstract: A microfabricated magnetic field transducer uses a magnetically sensitive structure in combination with one or more permeable magnetic flux guides. The flux guides may route off-axis components of an externally applied magnetic field across the sensitive axis of the magnetically sensitive structure, or may shield the magnetically sensitive structure from off-axis, stray fields or noise sources. A combination of flux guides and magnetically sensitive structures arranged on a single substrate may enable an integrated, 3-axis magnetometer in a single package, greatly improving cost and performance.

Abstract: A novel way for constructing and operating scanning probe microscopes to dynamically measure material properties of samples, mainly their surface hardness, by separating the functions of actuation, indentation and sensing into separate dynamic components. The amplitude and phase shift of higher modes occurring at periodic indentations with the sample are characteristic values for different sample materials. A separate sensor cantilever, connected to the indentation probe tip, has the advantage of a high mechanical amplification of a desired higher mode while suppressing the actuation signal itself. The operational range of the sensor can be extended just by switching the actuation signal to another submultiple of the sensor cantilever's resonance frequency and/or by using more than one sensor cantilever for each indentation tip.

Abstract: Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of integral device layers and further includes at least one coolant reservoir and at least one coolant channel. In an embodiment, the at least one coolant reservoir and at least one coolant channel are disposed wholly within the semiconductor die. In various embodiments, at least one coolant reservoir and at least one coolant channel are constructed and arranged to circulate coolant fluid in proximity to at least one IC device structure in order to decrease and or normalize an operating temperature of the IC device. In other embodiments, systems and methods for designing and/or fabricating IC die that include at least one intra-die cooling structure are provided herein.

Abstract: Aspects of the invention are directed to piezoresponse force analysis of a material. A stimulus signal including a first frequency component is applied to a contact point on the material such that the stimulus signal actuates a portion of the material to experience a motion as a result of a piezoelectric effect. A resonant device is coupled to the contact point such that the resonant device experiences a resonant motion at the first frequency component in response to the motion of the material, the resonant motion having a greater displacement than a displacement of the motion of the material, and is substantially unaffected by mechanical properties of the material at the contact point. The resonant motion of the resonant device is detected and processed to produce a measurement representing the piezoresponse of the material at the contact point.

Abstract: A novel way for constructing and operating scanning probe microscopes to dynamically measure material properties of samples, mainly their surface hardness, by separating the functions of actuation, indentation and sensing into separate dynamic components. The amplitude and phase shift of higher modes occurring at periodic indentations with the sample are characteristic values for different sample materials. A separate sensor cantilever, connected to the indentation probe tip, has the advantage of a high mechanical amplification of a desired higher mode while suppressing the actuation signal itself. The operational range of the sensor can be extended just by switching the actuation signal to another submultiple of the sensor cantilever's resonance frequency and/or by using more than one sensor cantilever for each indentation tip.