Patents by Inventor Benfei YE

Benfei YE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for testing semiconductor device
    Patent number: 12066460
    Abstract: A method for testing a semiconductor device comprises obtaining an alignment signal between one or more auxiliary pins of a test probe and one or more auxiliary pads of a test key of the semiconductor device before a probing test of the semiconductor device. The obtaining of the alignment signal comprises: performing a vertical alignment between the one or more auxiliary pins of the test probe and the one or more auxiliary pads of the test key; and gradually reducing a vertical distance between the one or more auxiliary pins of the test probe and the one or more auxiliary pads of the test key for bringing into an electrical contact until the alignment signal there-between satisfies an alignment condition.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: August 20, 2024
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Benfei Ye, Zhengpeng Zhu
  • METHOD AND APPARATUS FOR TESTING SEMICONDUCTOR DEVICE
    Publication number: 20230375595
    Abstract: A method for testing a semiconductor device comprises obtaining an alignment signal between one or more auxiliary pins of a test probe and one or more auxiliary pads of a test key of the semiconductor device before a probing test of the semiconductor device. The obtaining of the alignment signal comprises: performing a vertical alignment between the one or more auxiliary pins of the test probe and the one or more auxiliary pads of the test key; and gradually reducing a vertical distance between the one or more auxiliary pins of the test probe and the one or more auxiliary pads of the test key for bringing into an electrical contact until the alignment signal there-between satisfies an alignment condition.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Benfei YE, Zhengpeng ZHU