Patents by Inventor Beng Chew

Beng Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked Die in Die BGA Package
    Publication number: 20080096316
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 24, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked Die in Die BGA Package
    Publication number: 20080032449
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: October 15, 2007
    Publication date: February 7, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292743
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technolgoy, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292745
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060292746
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour
  • Stacked die in die BGA package
    Publication number: 20060216864
    Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 28, 2006
    Applicant: Micron Technology, Inc.
    Inventors: Hock Tan, Thiam Lim, Victor Tan, Chee Neo, Michael Tan, Beng Chew, Cheng Pour