Patents by Inventor Beng Kuan Lim

Beng Kuan Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structurally-enhanced integrated circuit package and method of manufacture
    Patent number: 7830006
    Abstract: A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free from encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: November 9, 2010
    Assignee: United Test and Assembly Center, Ltd.
    Inventors: Ravi Kanth Kolan, Hien Boon Tan, Anthony Yi Sheng Sun, Beng Kuan Lim, Krishnamoorthi Sivalingam
  • Structurally-enhanced integrated circuit package and method of manufacture
    Publication number: 20090072391
    Abstract: A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free form encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.
    Type: Application
    Filed: May 5, 2005
    Publication date: March 19, 2009
    Inventors: Ravi Kanth Kolan, Hien Boon Tan, Yi Sheng Anthony Sun, Beng Kuan Lim, Krishnamoorthi Sivalingam