Abstract: A semiconductor drying process apparatus comprising a processing chamber; two or more inlet/outlet openings formed in the processing chamber; a first pipe member coupled in fluid communication between one or more of the inlet/outlet openings of the processing chamber and a first drain valve; a second pipe member coupled in fluid communication between one or more other ones of the inlet/outlet openings of the processing chamber and a first supply valve; and wherein the first pipe member is coupled in fluid communication to the second pipe member for increasing the flow capacity of the semiconductor drying process apparatus.