Patents by Inventor Beng Lian Lim

Beng Lian Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIRECT CHIP ATTACH STRUCTURE AND METHOD
    Publication number: 20040266037
    Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Applicant: Semiconductor Components Industries, LLC.
    Inventors: James Knapp, Kok Yang Lau, Beng Lian Lim, Guan Keng Quah
  • Direct chip attach structure and method
    Patent number: 6835580
    Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: December 28, 2004
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: James Knapp, Kok Yang Lau, Beng Lian Lim, Guan Keng Quah