Patents by Inventor Beng Siong Lee

Beng Siong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patient interface formed from a textile construction and including a stiffened portion to provide for customization
    Patent number: 12201771
    Abstract: The invention relates to a patient interface comprising a plenum chamber, a seal-forming structure, and a positioning and stabilizing structure, as well as the method of operating the patient interface. The patient's interface is configured to leave a patient's mouth uncovered or if the seal-forming structure is configured to seal around a patient's nose and mouth, the patient interface is configured to allow the patient to breath from the ambient in an absence of the flow of pressurized. The positioning and stabilizing structure includes headgear, and the seal-forming structure and at least a portion of the headgear is formed from a one piece construction of textile material. In another embodiment, the seal-forming structure and/or the positioning and stabilizing structure includes an adaptive portion that adjusts based on usage conditions.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: January 21, 2025
    Assignee: ResMed Asia Pte. Ltd.
    Inventors: Deng Siong Lee, Mohankumar Krishnan Valiyambath, Robin Yew, Amit Arunchandra Jadhav, Wai Hoong Leng, Beng Hai Tan, Muhammad Adil Bin Abdul Halim, Nathalie Aurelie Champier Charpentier, Bangzheng Tan, Han Seong Chew, Barry Eng Keong Tay
  • Semiconductor device having die pads isolated from interconnect portion and method of assembling same
    Patent number: 8519519
    Abstract: A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: August 27, 2013
    Assignee: Freescale Semiconductor Inc.
    Inventors: Beng Siong Lee, Guat Kew Teh, Wai Keong Wong
  • SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
    Publication number: 20120104583
    Abstract: A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.
    Type: Application
    Filed: November 3, 2010
    Publication date: May 3, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC
    Inventors: Beng Siong Lee, Guat Kew Teh, Wai Keong Wong