Abstract: According to one aspect of the invention, there is provided a method of forming a film with a lenticular lens array, the method comprising providing a substrate; providing a mold having a plurality of nano-scale to micro-scale cavities that form the lenticular lens array on the substrate; having the mold contact the substrate; and forming the lenticular lens array by allowing portions of the substrate to partially fill the plurality of cavities.

Abstract: According to one aspect of the invention, there is provided a method of forming a film with a lenticular lens array, the method comprising providing a substrate; providing a mold having a plurality of nano-scale to micro-scale cavities that form the lenticular lens array on the substrate; having the mold contact the substrate; and forming the lenticular lens array by allowing portions of the substrate to partially fill the plurality of cavities.

Abstract: According to one aspect of the invention, there is provided an optical grating comprising a substrate comprising a plurality of protrusions with a space in between any two adjacent protrusions; and a cap provided on at least one of the plurality of protrusions at an end that is furthest from the substrate, wherein the cap has a higher degree of optical attenuation compared to the substrate material and wherein the combination of each protrusion and the respective cap thereon has a generally symmetric cross-sectional profile.

Abstract: According to one aspect of the invention, there is provided a method of forming a film with a lenticular lens array, the method comprising providing a substrate; providing a mold having a plurality of nano-scale to micro-scale cavities that form the lenticular lens array on the substrate; having the mold contact the substrate; and forming the lenticular lens array by allowing portions of the substrate to partially fill the plurality of cavities.

Abstract: According to one aspect of the invention, there is provided an optical grating comprising a substrate comprising a plurality of protrusions with a space in between any two adjacent protrusions; and a cap provided on at least one of the plurality of protrusions at an end that is furthest from the substrate, wherein the cap has a higher degree of optical attenuation compared to the substrate material and wherein the combination of each protrusion and the respective cap thereon has a generally symmetric cross-sectional profile.

Abstract: A semiconductor inspection system transports devices in trays from an input stacker to a flipping mechanism along a first inspection path in a first direction and from the flipping mechanism to an output stacker along a second inspection path in a second direction that is a different direction than the first direction. The flipping mechanism moves the devices from the first inspection path to a flipping location, flips the devices at the flipping location, and moves the devices to the second inspection path. In this manner, the devices can be inspected by a plurality of stations on different inspection paths and in different directions. One of the stations is an integrated station that performs both mark inspection and sorting of defective devices. A semiconductor inspection method is also described.