Patents by Inventor Beng Teong LOH

Beng Teong LOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200376729
    Abstract: Techniques for overmolding thermoplastics onto a spray primed polymer substrate. A thin layer of primer may be sprayed directly over a pre-formed polymer material. Then, a thermoplastic is injection molded directly over the primer layer. In one embodiment, a carbon fiber-reinforced polymer (CFRP) fabric is thermal compression molded into a NED device housing shell. Selected portions of the NED device housing shell may be mechanically abraded and then sprayed with a solvent-based polyolefin primer. Once the primer layer has cured, a thermoplastic material may then be overmolded directly over the primer layer—without any additional adhesive layer(s) between the primer layer and the thermoplastic material.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 3, 2020
    Inventors: Tao WANG, Brian J. TOLENO, Simon HODGSON, Beng Teong LOH