Patents by Inventor Beng Yee Teh

Beng Yee Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder Bumps
    Publication number: 20250096095
    Abstract: A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die to form a reconstituted wafer. A first insulating layer is formed over the reconstituted wafer. A first dummy opening is formed in the first insulating layer. A first conductive layer is formed on the first insulating layer including a first contact pad over the first dummy opening.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 20, 2025
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Peik Eng Ooi, Beng Yee Teh, Linda Pei Ee Chua
  • Semiconductor package system with patterned mask over thermal relief
    Patent number: 8274145
    Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: September 25, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Leocadio M. Alabin, Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, Jr.
  • SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF
    Publication number: 20090008768
    Abstract: A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
    Type: Application
    Filed: July 5, 2007
    Publication date: January 8, 2009
    Inventors: Leocadio M. Alabin, Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh, Antonio B. Dimaano, JR.