Abstract: A display panel and a display panel fabrication method are provided. The display panel comprises a display region; and a peripheral circuit region surrounding the display region. The display panel has a display surface facing viewers and covering the display region and the peripheral circuit region. At least one corner of the display panel is provided with a chamfer having a chamfer surface, the chamfer surface is a new side surface which is going to be introduced to the display panel after the chamfer is formed. A chamfer cutting reflective layer is disposed on the display surface of the display panel and along an edge of the chamfer surface. In a direction perpendicular to a chamfer cutting line and towards the at least one corner of the display panel, a thickness of the chamfer cutting reflective layer is reduced.

Abstract: The disclosure discloses an active matrix organic light emitting diode panel and a method for manufacturing the same. The active matrix organic light emitting diode panel includes: a substrate, an organic film formed on the substrate, and a plurality of red, green and blue organic light emitting diodes formed on the organic film. A first recess or a first protrusion is formed in the organic film in a region corresponding to the blue organic light emitting diode. The blue organic light emitting diode is formed on the first recess or first protrusion, and a contact area of the blue organic light emitting diode with the organic film is S r ? ? 0 Lifetime b ? ? 0 Lifetime r ? ? 0 n times as great as a contact area of the red organic light emitting film with the organic film, wherein n is a value ranging from 1.4 to 1.6.

Abstract: A thin film transistor array substrate includes a substrate, a plurality of pixel elements arranged on the substrate, each of the pixel elements including a thin film transistor and a pixel electrode electrically connected with the thin film transistor, a light shielding electrode disposed between the substrate and the thin film transistor to shield a channel of the thin film transistor, and a storage capacitor including a first electrode and a second electrode disposed opposite to each other. The light shielding electrode includes a transparent electrically-conductive layer and a non-transparent electrically-conductive layer stacked on top of each other. The first electrode of the storage capacitor is disposed in a same layer and of a same material as the transparent electrically-conductive layer of the light shielding electrode.

Abstract: A display panel and a display panel fabrication method are provided. The display panel comprises a display region; and a peripheral circuit region surrounding the display region. The display panel has a display surface facing viewers and covering the display region and the peripheral circuit region. At least one corner of the display panel is provided with a chamfer having a chamfer surface, the chamfer surface is a new side surface which is going to be introduced to the display panel after the chamfer is formed. A chamfer cutting reflective layer is disposed on the display surface of the display panel and along an edge of the chamfer surface. In a direction perpendicular to a chamfer cutting line and towards the at least one corner of the display panel, a thickness of the chamfer cutting reflective layer is reduced.

Abstract: The disclosure discloses an active matrix organic light emitting diode panel and a method for manufacturing the same. The active matrix organic light emitting diode panel includes: a substrate, an organic film formed on the substrate, and a plurality of red, green and blue organic light emitting diodes formed on the organic film. A first recess or a first protrusion is formed in the organic film in a region corresponding to the blue organic light emitting diode. The blue organic light emitting diode is formed on the first recess or first protrusion, and a contact area of the blue organic light emitting diode with the organic film is S r ? ? 0 Lifetime b ? ? 0 Lifetime r ? ? 0 n times as great as a contact area of the red organic light emitting film with the organic film, wherein n is a value ranging from 1.4 to 1.6.

Abstract: The invention discloses an active matrix organic light emitting diode panel and a method for manufacturing the same. The active matrix organic light emitting diode panel includes a substrate, an organic film formed on the substrate, and a plurality of red, green and blue organic light emitting diodes formed on the organic film. A recess or protrusion is formed in the organic film in a region corresponding to the blue organic light emitting diode. The blue organic light emitting diode is formed on the recess or protrusion, and the surface area of the recess or protrusion is larger than the area of the surface where the red or green organic light emitting diodes contacts the organic film.

Abstract: A method of preparing an OGS touch screen is disclosed. The method includes forming a first film layer on a provided substrate, where the first film layer includes at least one hollow region and a protection film surrounding each hollow region. The method also includes tempering each hollow region by tempering the substrate, and removing the protection film on the substrate.

Abstract: An Organic Light Emitting Diode (OLED) display panel is disclosed. The display panel includes a substrate, a plurality of power lines disposed on the substrate, and a reflection layer disposed on the power lines, where the reflection layer is electrically connected with the power lines. The display panel also includes an anode disposed on the reflection layer, an optical modulation layer disposed between the reflection layer and the anode, a cathode disposed on the anode, and an organic emitting device layer disposed between the anode and the cathode, where the reflection layer is insulated from the anode, and the OLED display panel is configured to transmit light from a side of the reflection layer away from the substrate.

Abstract: An Organic Light-Emitting Diode (OLED) display device and a corresponding flexible printed circuit (FPC) are disclosed. The display device includes a first substrate and a second substrate arranged in opposition. In addition, frit is arranged on an inner side of the first substrate, and the display device also includes at least one bonding mark, where the bonding mark includes the frit, and at least one sub-bonding mark arranged on a surface of the first substrate. The at least one sub-bonding mark includes a first portion and a second portion arranged apart from each other, and the first portion and the second portion are arranged at an edge of the frit. The FPC includes at least one auxiliary bonding mark aligning the FPC to the OLED display device, where the at least one auxiliary bonding mark is aligned with the at least one sub-bonding mark of the OLED display device.

Abstract: An Organic Light Emitting Diode (OLED) display panel is disclosed. The display panel includes a substrate, a plurality of power lines disposed on the substrate, and a reflection layer disposed on the power lines, where the reflection layer is electrically connected with the power lines. The display panel also includes an anode disposed on the reflection layer, an optical modulation layer disposed between the reflection layer and the anode, a cathode disposed on the anode, and an organic emitting device layer disposed between the anode and the cathode, where the reflection layer is insulated from the anode, and the OLED display panel is configured to transmit light from a side of the reflection layer away from the substrate.

Abstract: A method of manufacturing an Organic Light Emitting Diode (OLED) pixel is disclosed. The method includes forming an anode and forming a pixel definition layer. The pixel definition layer includes a first sub-pixel area, a second sub-pixel area, a third sub-pixel area corresponding to the third sub-pixel, and a pixel spacing area. The first sub-pixel, the second sub-pixel and the third sub-pixel are separated from each other by the pixel spacing area. The method also includes coating a long-chain fatty acid ester layers on the pixel spacing area, the second sub-pixel area, and the third sub-pixel area, coating light emitting layers on the sub-pixel areas and on the long-chain fatty acid ester layers, and ashing the substrate and removing the long-chain fatty acid ester layers to form light emitting patterns. The method also includes forming a cathode.

Abstract: An Organic Light-Emitting Diode (OLED) display device and a corresponding flexible printed circuit (FPC) are disclosed. The display device includes a first substrate and a second substrate arranged in opposition. In addition, frit is arranged on an inner side of the first substrate, and the display device also includes at least one bonding mark, where the bonding mark includes the frit, and at least one sub-bonding mark arranged on a surface of the first substrate. The at least one sub-bonding mark includes a first portion and a second portion arranged apart from each other, and the first portion and the second portion are arranged at an edge of the frit. The FPC includes at least one auxiliary bonding mark aligning the FPC to the OLED display device, where the at least one auxiliary bonding mark is aligned with the at least one sub-bonding mark of the OLED display device.

Abstract: A method of manufacturing an Organic Light Emitting Diode (OLED) pixel is disclosed. The method includes forming an anode and forming a pixel definition layer. The pixel definition layer includes a first sub-pixel area, a second sub-pixel area, a third sub-pixel area corresponding to the third sub-pixel, and a pixel spacing area. The first sub-pixel, the second sub-pixel and the third sub-pixel are separated from each other by the pixel spacing area. The method also includes coating a long-chain fatty acid ester layers on the pixel spacing area, the second sub-pixel area, and the third sub-pixel area, coating light emitting layers on the sub-pixel areas and on the long-chain fatty acid ester layers, and ashing the substrate and removing the long-chain fatty acid ester layers to form light emitting patterns. The method also includes forming a cathode.

Abstract: A method of preparing an OGS touch screen is disclosed. The method includes forming a first film layer on a provided substrate, where the first film layer includes at least one hollow region and a protection film surrounding each hollow region. The method also includes tempering each hollow region by tempering the substrate, and removing the protection film on the substrate.

Abstract: An OLED package structure includes: a substrate, on which an organic light-emitting element is provided, and a cover plate having an annular groove surrounding the organic light-emitting element thereon. A packaging adhesive, partly inside the groove and partly outside the groove, adheres the cover plate to the substrate to seal the organic light-emitting element. In the OLED package structure according to the present invention, the thickness of the spacer can be smaller, so as to eliminate color mixture during an evaporation process and to prevent a Newton ring phenomenon in the OLED package structure.

Abstract: A thin film transistor array substrate includes a substrate, a plurality of pixel elements arranged on the substrate, each of the pixel elements including a thin film transistor and a pixel electrode electrically connected with the thin film transistor, a light shielding electrode disposed between the substrate and the thin film transistor to shield a channel of the thin film transistor, and a storage capacitor including a first electrode and a second electrode disposed opposite to each other. The light shielding electrode includes a transparent electrically-conductive layer and a non-transparent electrically-conductive layer stacked on top of each other. The first electrode of the storage capacitor is disposed in a same layer and of a same material as the transparent electrically-conductive layer of the light shielding electrode.

Abstract: An OLED package structure includes: a substrate, on which an organic light-emitting element is provided, and a cover plate having an annular groove surrounding the organic light-emitting element thereon. A packaging adhesive, partly inside the groove and partly outside the groove, adheres the cover plate to the substrate to seal the organic light-emitting element. In the OLED package structure according to the present invention, the thickness of the spacer can be smaller, so as to eliminate color mixture during an evaporation process and to prevent a Newton ring phenomenon in the OLED package structure.

Abstract: The invention discloses an active matrix organic light emitting diode panel and a method for manufacturing the same. The active matrix organic light emitting diode panel includes a substrate, an organic film formed on the substrate, and a plurality of red, green and blue organic light emitting diodes formed on the organic film. A recess or protrusion is formed in the organic film in a region corresponding to the blue organic light emitting diode. The blue organic light emitting diode is formed on the recess or protrusion, and the surface area of the recess or protrusion is larger than the area of the surface where the red or green organic light emitting diodes contacts the organic film.