Patents by Inventor BengSee Lim

BengSee Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7417823
    Abstract: An apparatus and method for mounting a shock sensor to the printed circuit board (PCB) of a disc drive are provided. In particular, the present invention allows the shock sensor to be mounted at any location on the printed circuit board rather than being limited to placement adjacent a mounting screw. The present invention includes a clamping mechanism for rigidly clamping the PCB to the head disc assembly (HDA) so that any shock is properly transmitted from the HDA to the PCB and then to the shock sensor. In one exemplary embodiment, the PCB is clamped between a shield and the HDA. The shock sensor is then position near the point at which the PCB is clamped so that the point of clamping provides transmission of any shock in the Z-axis to the shock sensor. Shocks in the X-Y axis direction are transmitted via the normal mounting screws.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: August 26, 2008
    Assignee: Seagate Technology LLC
    Inventors: BengSee Lim, WaiOnn Chee, PeiKoh Lee, Jimmy TzeMing Pang, BoonSeng Ong, Niroot Jierapipatanakul
  • Publication number: 20060198045
    Abstract: An apparatus and method for mounting a shock sensor to the printed circuit board (PCB) of a disc drive are provided. In particular, the present invention allows the shock sensor to be mounted at any location on the printed circuit board rather than being limited to placement adjacent a mounting screw. The present invention includes a clamping mechanism for rigidly clamping the PCB to the head disc assembly (HDA) so that any shock is properly transmitted from the HDA to the PCB and then to the shock sensor. In one exemplary embodiment, the PCB is clamped between a shield and the HDA. The shock sensor is then position near the point at which the PCB is clamped so that the point of clamping provides transmission of any shock in the Z-axis to the shock sensor. Shocks in the X-Y axis direction are transmitted via the normal mounting screws.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 7, 2006
    Inventors: BengSee Lim, WaiOnn Chee, PeiKoh Lee, Jimmy Pang, BoonSeng Ong, Niroot Jierapipatanakul
  • Patent number: 6317285
    Abstract: A method of calibrating magnetoresistive (MR) head geometry for a product head in a selfservo writing disc drive includes the steps of writing a first burst at an inner diameter of a disc surface using the write head of the product head. Next, the first burst is read using the MR read head of the product head, and a first read amplitude of the first burst is determined. From the first read amplitude of the first burst, it is determined which one of a multiple different sets of subsequent inner diameter steps to perform. Then, the one of the multiple different sets of subsequent inner diameter steps is performed to determine a read head width, a write head width, and a read-write offset between the read head and the write head.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: November 13, 2001
    Assignee: Seagate Technology LLC
    Inventors: Qiang Bi, Kevin Arthur Gomez, Jimmy Tze Ming Pang, Stephen Kow Chiew Kuan, MengEng Lye, BengSee Lim