Patents by Inventor Benjamin A. Cousins

Benjamin A. Cousins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230301408
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 28, 2023
    Applicant: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20230269509
    Abstract: A deformable ear tip comprising: an annular inner ear tip body having a sidewall extending between first and second opposing ends thereby defining a sound channel through the ear tip; an annular outer flange integrally formed with and surrounding the first end of the inner ear tip body and extending towards the inner ear tip second end forming an air gap between the annular inner ear tip body and the annular outer flange along a portion of a length of the ear tip, wherein the outer flange comprises a first material having a first durometer and is sized and shaped to be inserted into a human ear canal; and an inner flange integrally formed with the inner ear tip body and comprising a second material having a second durometer less than the first durometer, the inner flange body extending from a location along the inner ear tip body between the first and second ends towards an inner surface of the outer flange body.
    Type: Application
    Filed: August 24, 2022
    Publication date: August 24, 2023
    Applicant: APPLE INC.
    Inventors: Benjamin A. Cousins, Robert Chun, Priyanka Venkatesh, Thanh P. Hua, Jarrett Lagler, Hanchi Chen
  • Publication number: 20230269514
    Abstract: An earphone comprising: a device housing that defines an interior cavity within the device housing; an acoustic port formed through a wall of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; a user input region disposed along an exterior surface of the device housing; a flex circuit disposed within the interior cavity, the flex circuit including a first portion bonded at a first location to an inner surface of the device housing directly beneath the user-input region, a second portion bonded at a second location to an inner surface of the device housing spaced apart from the first location, and a third portion extending between the first and second portions; a force pixel disposed within the interior cavity and mounted to the first portion of the flex circuit below the user input region; a plurality of touch pixels disposed within the interior cavity between the force pixel and the user input region; sensor control circuitry disposed w
    Type: Application
    Filed: August 24, 2022
    Publication date: August 24, 2023
    Applicant: APPLE INC.
    Inventors: Benjamin A. Cousins, Travis Owens, Karan Jain, Lee M. Panecki, Mei Zhang, Julia Canning
  • Publication number: 20230269513
    Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front vol
    Type: Application
    Filed: August 24, 2022
    Publication date: August 24, 2023
    Applicant: APPLE INC.
    Inventors: Benjamin A. Cousins, Jarrett Lagler, Dirk Schmelzer, Sebastien D. de Rivaz, Tian Shi Li, Phillip Qian, Rebecca Russell, Jeyakkrishnan Chengleput Srinivasan, Jue Wang, Jerzy S. Guterman, Joel C. Yamasaki
  • Patent number: 11690428
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: July 4, 2023
    Assignee: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20230088030
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Application
    Filed: November 22, 2022
    Publication date: March 23, 2023
    Applicant: APPLE INC.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11540039
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: December 27, 2022
    Assignee: APPLE INC.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11503399
    Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: November 15, 2022
    Assignee: APPLE INC.
    Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
  • Publication number: 20220103930
    Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
    Type: Application
    Filed: April 27, 2021
    Publication date: March 31, 2022
    Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
  • Patent number: 11206473
    Abstract: Embodiments describe a magnetic securing component including a set of magnets positioned laterally adjacent to one another and having a curved top surface defined by individual curved top surfaces of each magnet in the set of magnets. The set of magnets includes: first and second magnets positioned laterally adjacent to one another, where the first and second magnets each have a polarity that is oriented parallel to a vertical dimension; and third and fourth magnets laterally positioned from the first and second magnets, where the third magnet is positioned adjacent to the first magnet and the fourth magnet is positioned adjacent to the second magnet, the third and fourth magnets each having a magnetic polarity that is oriented at an angle with respect to the vertical dimension.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 21, 2021
    Assignee: Apple Inc.
    Inventors: Qigen Ji, Hao Zhu, Haochuan Sang, Benjamin A. Cousins, Meiting Wu
  • Patent number: 11206472
    Abstract: Embodiments describe an acoustic shielding component including a stiffener formed of a rigid material providing structural integrity to the acoustic shielding component, a cosmetic mesh comprising a plurality of interlaced wires, and an acoustic mesh disposed between the stiffener and the cosmetic mesh. The stiffener includes first and second walls extending along a length of the stiffener and a plurality of ribs spaced apart from each other and extending between the first and second walls. The cosmetic mesh includes a mesh cover disposed over the stiffener and having an outer surface and an inner surface, and a mesh wall extending from an outer periphery of the inner surface of the mesh cover and defining a tab.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 21, 2021
    Assignee: Apple Inc.
    Inventors: Benjamin A. Cousins, Esge Andersen, Mei Zhang, Brian R. Twehues, Ethan L. Huwe, Thanh P. Hua
  • Patent number: 11159869
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 26, 2021
    Assignee: Apple Inc.
    Inventors: Scott C. Grinker, Esge Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker, Sean T. McIntosh, Jason C. Della Rosa, Craig M. Stanley, Edward Siahaan, Ethan W. Juhnke
  • Publication number: 20210274273
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 2, 2021
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20210211796
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 11026011
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: June 1, 2021
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 11026010
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: June 1, 2021
    Assignee: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20210152912
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: December 22, 2020
    Publication date: May 20, 2021
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 10986433
    Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 20, 2021
    Assignee: Apple Inc.
    Inventors: Sean T. McIntosh, Jason C. Della Rosa, Samuel G. Parker, Benjamin A. Cousins, Ethan L. Huwe
  • Patent number: 10944156
    Abstract: An electronic device such as a wireless earbud may have antenna structures that are configured to form one or more antenna portions or antennas for transmitting and receiving wireless signals. The device may include control circuitry that is configured to selectively activate one or more antennas or antenna portions to transmit and receive wireless signals for the device. The device may include sensor circuitry that provide sensor data to the control circuitry. The control circuitry may use the sensor data to select and activate an optimal antenna based on the orientation of the earbud or the environment of the device. The antennas may be formed on opposing sides of a housing for the device. By providing configurable antenna structures, the device may be configured to adapt to the current environment and efficiently perform communications operations.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 9, 2021
    Assignee: Apple Inc.
    Inventors: Benjamin A. Cousins, Carlo Di Nallo, Ethan L. Huwe, Jerzy S. Guterman, Joachim S. Hammerschmidt, Mattia Pascolini, Ruben Caballero, Samuel G. Parker
  • Patent number: 10911863
    Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: February 2, 2021
    Assignee: Apple Inc.
    Inventors: Glenn K. Trainer, Rong Liu, Benjamin A. Cousins, Yupin Sun, Jun Qi, Jason W. Brinsfield, Ethan L. Huwe, Craig M. Stanley, Molly J. Anderson, Javier Mendez