Patents by Inventor Benjamin Alexander Haag

Benjamin Alexander Haag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210155835
    Abstract: The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.
    Type: Application
    Filed: April 10, 2018
    Publication date: May 27, 2021
    Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
    Inventors: Andreas Lutz, Daniel Schneider, Benjamin Alexander Haag, Irene Maeder, Marcel Aschwanden
  • Publication number: 20200140727
    Abstract: Room temperature curing, two-component epoxy adhesives useful in bonding oily substrates include a resin side A and a curative side B. The resin side A includes an epoxy resin, a toughening component, a plasticizer and filler, and the curative side B includes a polyetheramine, amine-terminated butadiene rubber and a curing catalyst.
    Type: Application
    Filed: August 4, 2018
    Publication date: May 7, 2020
    Applicant: DDP SPECIALTY ELECTRONICS MATERIALS US, INC.
    Inventors: Benjamin Alexander Haag, Andreas Lutz, Beda Steiner
  • Patent number: 10435600
    Abstract: An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, for example, in manufacturing processes, for example, in the automobile industry. The composition also provides unique viscosity profile after pre-gelling to significantly reduce failure mode in subsequent processing steps. In preferred embodiments the adhesive composition comprises an epoxy type resin and a gelling agent selected from polyesterdiols and polyvinyl butyrals.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: October 8, 2019
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Andreas Lutz, Jeannine Flueckiger, Benjamin Alexander Haag, Regina Ditschuneit
  • Patent number: 10190028
    Abstract: The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: January 29, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Andreas Lutz, Benjamin Alexander Haag, Beda Steiner
  • Publication number: 20180163100
    Abstract: The invention relates to resin compositions for epoxy adhesives, comprising a di-functional aromatic epoxy compound. The resin compositions and/or uncured adhesive compositions having low viscosity at low temperatures. Adhesives made therefrom have good strength and bulk properties. The invention includes methods of making and using the compositions, as well as adhesives made from the compositions.
    Type: Application
    Filed: March 24, 2015
    Publication date: June 14, 2018
    Applicant: Dow Europe GmbH
    Inventors: Andreas A Lutz, Benjamin Alexander Haag, Beda Steiner
  • Publication number: 20170022402
    Abstract: An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, for example, in manufacturing processes, for example, in the automobile industry. The composition also provides unique viscosity profile after pre-gelling to significantly reduce failure mode in subsequent processing steps. In preferred embodiments the adhesive composition comprises an epoxy type resin and a gelling agent selected from polyesterdiols and polyvinyl butyrals.
    Type: Application
    Filed: March 19, 2015
    Publication date: January 26, 2017
    Applicants: Dow Europe GmbH, Dow Deutschland Vertriebs GmbH & Co. OHG, The Dow Chemical Company
    Inventors: Andreas Lutz, Jeannine Flueckiger, Benjamin Alexander Haag, Regina Ditschuneit