Patents by Inventor Benjamin Alles

Benjamin Alles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for filling a contact hole in a chip package arrangement and chip package arrangements
    Patent number: 8728873
    Abstract: In various embodiments, a method for filling a contact hole in a chip package arrangement is provided. The method may include introducing electrically conductive discrete particles into a contact hole of a chip package; and forming an electrical contact between the electrically conductive particles and a contact terminal of the front side and/or the back side of the chip.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: May 20, 2014
    Assignee: Infineon Technologies AG
    Inventors: Benjamin Alles, Joachim Mahler, Edward Fuergut, Ivan Nikitin
  • Methods for filling a contact hole in a chip package arrangement and chip package arrangements
    Publication number: 20120061845
    Abstract: In various embodiments, a method for filling a contact hole in a chip package arrangement is provided. The method may include introducing electrically conductive discrete particles into a contact hole of a chip package; and forming an electrical contact between the electrically conductive particles and a contact terminal of the front side and/or the back side of the chip.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 15, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Benjamin Alles, Joachim Mahler, Edward Fuergut, Ivan Nikitin