Patents by Inventor Benjamin Amar

Benjamin Amar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular laser processing enclosure and system
    Patent number: 10821552
    Abstract: A modular laser processing enclosure includes an enclosure housing defining a laser processing area. The enclosure housing includes a top defining a top laser processing access opening providing access to the laser processing area and at least two sides defining side laser processing access openings providing access to the laser processing area. The side laser processing access openings may be located proximate the top of the enclosure housing. The enclosure may further include at least one plate configured to cover any one of the laser processing access openings. Optionally, at least one laser processing head may be configured to be mounted to any one of the laser processing access openings and/or a least one part handling mechanism may be provided to access the laser processing area through any one of the laser processing access openings for delivering parts to and/or from the laser processing area.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 3, 2020
    Assignee: IPG PHOTONICS CORPORATION
    Inventors: Joseph Dallarosa, Benjamin Amar, Mark Labbe
  • MODULAR LASER PROCESSING ENCLOSURE AND SYSTEM
    Publication number: 20190091806
    Abstract: A modular laser processing enclosure includes an enclosure housing defining a laser processing area. The enclosure housing includes a top defining a top laser processing access opening providing access to the laser processing area and at least two sides defining side laser processing access openings providing access to the laser processing area. The side laser processing access openings may be located proximate the top of the enclosure housing. The enclosure may further include at least one plate configured to cover any one of the laser processing access openings. Optionally, at least one laser processing head may be configured to be mounted to any one of the laser processing access openings and/or a least one part handling mechanism may be provided to access the laser processing area through any one of the laser processing access openings for delivering parts to and/or from the laser processing area.
    Type: Application
    Filed: November 3, 2016
    Publication date: March 28, 2019
    Inventors: JOSEPH DALLAROSA, BENJAMIN AMAR, MARK LABBE
  • Laser processing system enclosure
    Patent number: D796974
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: September 12, 2017
    Assignee: IPG Photonics Corporation
    Inventors: Joseph Dallarosa, Benjamin Amar, Mark Labbe