Patents by Inventor Benjamin ARDAILLON

Benjamin ARDAILLON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic die testing device and method
    Patent number: 11879909
    Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: January 23, 2024
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SAS
    Inventors: Klodjan Bidaj, Benjamin Ardaillon, Lauriane Gateka
  • ELECTRONIC DIE TESTING DEVICE AND METHOD
    Publication number: 20230036484
    Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.
    Type: Application
    Filed: July 20, 2022
    Publication date: February 2, 2023
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SAS
    Inventors: Klodjan BIDAJ, Benjamin ARDAILLON, Lauriane GATEKA