Abstract: A power semiconductor module includes a first and second insulating substrate, which is arranged parallel to and at a distance from the first insulating substrate. The first insulating substrate and the second insulating substrate each include an insulating layer, an inner metallization layer, and an outer metallization layer. The power semiconductor module also includes a first cooling device, which is arranged thermally conductively on the outer metallization layer of the first insulating substrate, a second cooling device, which is arranged thermally conductively on the outer metallization layer of the second insulating substrate. The power semiconductor module also includes a power semiconductor, arranged between the first insulating substrate and the second insulating substrate.

Abstract: The inventive method comprises chemically-mechanically polishing a substrate with a polishing composition comprising a liquid carrier and sol-gel colloidal silica abrasive particles.

Abstract: The invention provides a chemical-mechanical polishing composition consisting essentially of silica, an oxidizing agent, a quaternary ammonium compound, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition provides for enhanced polishing rates when used to polish dielectric films.

Abstract: The invention provides a method of preparing a chemical-mechanical polishing composition for polishing a substrate with at least a first layer and a second layer. The method comprises providing both a first chemical-mechanical polishing composition comprising an abrasive with a selectivity for a first layer as compared to a second layer and a second chemical-mechanical polishing composition comprising an abrasive with different selectivity for the first layer as compared to the second layer, wherein the second chemical-mechanical polishing composition is stable in the presence of the first chemical-mechanical polishing composition, and mixing the first and second chemical-mechanical polishing compositions in a ratio to achieve a final selectivity for the first layer as compared to the second layer. The invention further provides a method of chemically-mechanically polishing a substrate.

Abstract: The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.

Abstract: The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and ?-hydroxycarbonyl compounds.

Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water. The invention also provides a chemical-mechanical polishing composition comprising: (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of at least one metal selected from the group consisting of calcium, strontium, barium, magnesium, zinc, and mixtures thereof, based on the total weight of the polishing composition, and (c) a liquid carrier comprising water.

Abstract: The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, (ii) a reducing agent, and (iii) a liquid carrier, and (c) abrading at least a portion of the metal in an oxidized form to polish the substrate. The reducing agent can be selected from the group consisting of 3-hydroxy-4-pyrones, ?-hydroxy-?-butyrolactones, ascorbic acid, borane, borohydrides, dialkylamine boranes, formaldehyde, formic acid, hydrogen, hydroquinones, hydroxylamine, hypophosphorous acid, phosphorous acid, a metal or metal ions in an oxidation state having a standard redox potential that is less than the standard redox potential of the metal in an oxidized form, trihydroxybenzenes, solvated electrons, sulfurous acid, salts thereof, and mixtures thereof.

Abstract: The invention relates to a device for adjusting a relative position between two components, having a support part which is fastened to the one component and has a through-opening in a holder section. The device includes a setting screw which has an external thread that engages in the region of its one end in an internal thread firmly arranged on the other component. The setting screw has rotary actuating means on its other end, has a radially projecting, fixed collar between its ends, and passes through the through-opening on a side of the collar remote from the other component. The setting screw carries a lock nut on a side of the holder section remote from the other component, the collar and lock nut axially restraining the holder section between them for fixing a relative position between setting screw and support part.

Abstract: The invention relates to a device for adjusting a relative position between two components, having a support part which is fastened to the one component and has a through-opening in a holder section. The device includes a setting screw which has an external thread that engages in the region of its one end in an internal thread firmly arranged on the other component. The setting screw has rotary actuating means on its other end, has a radially projecting, fixed collar between its ends, and passes through the through-opening on a side of the collar remote from the other component. The setting screw carries a lock nut on a side of the holder section remote from the other component, the collar and lock nut axially restraining the holder section between them for fixing a relative position between setting screw and support part.