Patents by Inventor Benjamin Bernard

Benjamin Bernard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12256212
    Abstract: A plurality of microphone signals of a microphone array may be obtained. An environment change may be detected based on the microphone signals. In response, a reverberation time environment may be determined. The reverberation may be used to modify a playback audio signal.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: March 18, 2025
    Assignee: Apple Inc.
    Inventors: Benjamin Bernard, Prateek Murgai, Juha O. Merimaa, Jonathan D. Sheaffer, Soenke Pelzer
  • Patent number: 12185064
    Abstract: An electrically or partially electrically driven vehicle has a system (1) for active sound design. Active sound design sounds emitted by one or more loudspeakers (5) are modified depending on the driver type and/or depending on the current driving style. The system (1) has at least one sensor for recording measurement parameters (2) that permit a classification of a current driving style and/or a driver type of a driver of the vehicle. The device (1) has a classification device (3) that is configured to determine the current driving style and/or driver type of the driver of the vehicle based on the measurement parameters (2) recorded by the at least one sensor. The system (1) has a sound control system for controlling and modifying the sounds emitted by the loudspeakers (5) based on the current driving style and/or driver type classified by the classification device (3).
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: December 31, 2024
    Assignee: Dr. Ing. h. c. F. Porsche AG
    Inventors: Benjamin Bernard, Bjoern Seinecke
  • Patent number: 12180913
    Abstract: A ducted fan of an aircraft includes a rotor-side fan and a stator-side duct that surrounds the rotor-side fan radially at the outside and defines a flow channel for air flowing via the fan. The stator-side duct has an inner wall that faces toward the rotor-side fan and which is perforated at least in certain sections. The stator-side duct has an outer wall that faces away from the fan. Between the inner wall and the outer wall of the stator-side duct, there are formed cavities which, forming sound-deadening resonators, are coupled via the perforated inner wall to the flow channel for the air flowing via the rotor-side fan. The cavities are filled, in a region which faces away from the inner wall and thus faces toward the outer wall, with activated carbon.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: December 31, 2024
    Assignee: DR. ING. H.C. F. PORSCHE AKTIENGESELLSCHAFT
    Inventor: Benjamin Bernard
  • Patent number: 12170226
    Abstract: A method for separating dies from a semiconductor substrate having dies adjoining a first surface of the substrate includes: attaching the substrate to a carrier via the first surface; generating first modifications by introducing laser irradiation into an interior of the substrate via a second surface of the substrate, the first modifications extending between the first surface and a vertical level in the interior that is being spaced from the second surface, the first modifications laterally surrounding the dies; generating second modifications by introducing laser irradiation into the interior via the second surface, the second modifications sub-dividing the substrate into a first part between the first surface and the second modifications, and a second part between the second surface and the second modifications; separating the parts along a first separation area defined by the second modifications; and separating the dies along a second separation area defined by the first modifications.
    Type: Grant
    Filed: March 28, 2024
    Date of Patent: December 17, 2024
    Assignee: Infineon Technologies AG
    Inventors: Franz-Josef Pichler, Benjamin Bernard, Mario Stefenelli
  • Publication number: 20240371793
    Abstract: A semiconductor device includes: a semiconductor die having a front side surface, a backside surface opposite the front side surface, and side faces; a backside metallization layer at least partly covering the backside surface of the semiconductor die and projecting laterally outwards beyond the side faces of the semiconductor die; and a protection layer at least partly covering the side faces of the semiconductor die. The backside metallization layer projects laterally outwards beyond the protection layer.
    Type: Application
    Filed: July 16, 2024
    Publication date: November 7, 2024
    Inventors: Christian Gruber, Benjamin Bernard, Tobias Polster, Carsten von Koblinski
  • Publication number: 20240339361
    Abstract: A method for separating dies from a semiconductor substrate having dies adjoining a first surface of the substrate includes: attaching the substrate to a carrier via the first surface; generating first modifications by introducing laser irradiation into an interior of the substrate via a second surface of the substrate, the first modifications extending between the first surface and a vertical level in the interior that is being spaced from the second surface, the first modifications laterally surrounding the dies; generating second modifications by introducing laser irradiation into the interior via the second surface, the second modifications sub-dividing the substrate into a first part between the first surface and the second modifications, and a second part between the second surface and the second modifications; separating the parts along a first separation area defined by the second modifications; and separating the dies along a second separation area defined by the first modifications.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 10, 2024
    Inventors: Franz-Josef Pichler, Benjamin Bernard, Mario Stefenelli
  • Patent number: 12094837
    Abstract: A method of manufacturing a semiconductor device includes: forming grooves in a front side surface of a wafer; filling the grooves with a first side face protection material; thinning the wafer at a backside surface of the wafer opposite the front side surface; depositing a backside metallization layer over the backside surface of the thinned wafer; and laser cutting along the grooves through the side face protection material and through the backside metallization layer to separate the wafer into multiple semiconductor devices.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: September 17, 2024
    Assignee: Infineon Technologies AG
    Inventors: Christian Gruber, Benjamin Bernard, Tobias Polster, Carsten von Koblinski
  • Patent number: 12054096
    Abstract: A method for simulating a noise in a motor vehicle includes the steps of defining a virtual noise source in a position outside the motor vehicle; simulating a noise from the virtual noise source, wherein the simulation takes place using real noise sources inside the motor vehicle; and changing the position of the virtual noise source relative to the motor vehicle depending on a speed of the motor vehicle.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: August 6, 2024
    Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventor: Benjamin Bernard
  • Publication number: 20240256909
    Abstract: A method of providing implicit feedback using multi-factor behavior monitoring according to an embodiment includes receiving, by a computing system, a transcript of a conversation between an agent and a user, providing, by the computing system, at least one suggestion to the agent via an agent application based on the transcript of the conversation between the agent and the user, evaluating, by the computing system, data indicative of behaviors of the agent with respect to the at least one suggestion using machine learning, and updating, by the computing system, a knowledge base model based on the evaluation of the data indicative of behaviors of the agent with respect to the at least one suggestion using machine learning.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 1, 2024
    Inventors: Stéphane Blécon, Benjamin Bernard
  • Publication number: 20240060370
    Abstract: A system includes a container unit and a processor. The container unit includes a first fluid pathway having an inlet configured to couple to a first component of a drilling fluid circulation system, and having an outlet configured to couple to a second component of the drilling fluid circulation system. The container unit also includes a second fluid pathway having an inlet configured to couple to a third component of the drilling fluid circulation system, and having an outlet configured to couple to the third component. The container unit includes a first sensor coupled to the first fluid pathway and a second sensor coupled to the second fluid pathway. The processor is configured to determine a drilling fluid profile based on data from the sensors, and compare the determined drilling fluid profile to a target drilling fluid profile to determine an adjustment for an actual drilling fluid profile.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 22, 2024
    Applicant: Aerion Rental Services LLC
    Inventors: Benjamin Bernard, Matthew Bernard, Jeffrey Bernard
  • Publication number: 20230276190
    Abstract: A plurality of microphone signals of a microphone array may be obtained. An environment change may be detected based on the microphone signals. In response, a reverberation time environment may be determined. The reverberation may be used to modify a playback audio signal.
    Type: Application
    Filed: January 19, 2023
    Publication date: August 31, 2023
    Inventors: Benjamin BERNARD, Prateek MURGAI, Juha O. MERIMAA, Jonathan D. SHEAFFER, Soenke PELZER
  • Publication number: 20230187381
    Abstract: A method of manufacturing a semiconductor device includes: forming grooves in a front side surface of a wafer; filling the grooves with a first side face protection material; thinning the wafer at a backside surface of the wafer opposite the front side surface; depositing a backside metallization layer over the backside surface of the thinned wafer; and laser cutting along the grooves through the side face protection material and through the backside metallization layer to separate the wafer into multiple semiconductor devices.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventors: Christian Gruber, Benjamin Bernard, Tobias Polster, Carsten von Koblinski
  • Publication number: 20230104111
    Abstract: One or more acoustic parameters of a current acoustic environment of a user may be determined based on sensor signals captured by one or more sensors of the device. One or more preset acoustic parameters may be determined based on the one or more acoustic parameters of the current acoustic environment of the user and an acoustic environment of an audio file comprising audio signals that is determined based on the audio signals of the audio file or metadata of the audio file. The audio signals may be spatially rendered by applying spatial filters that include the one or more preset acoustic parameters to the audio signals, resulting in binaural audio signals. The binaural audio signals may be used to drive speakers of a headset. Other aspects are described and claimed.
    Type: Application
    Filed: August 19, 2022
    Publication date: April 6, 2023
    Inventors: Prateek Murgai, John E. Arthur, Joshua D. Atkins, Juha O. Merimaa, Dipanjan Sen, Brandon J. Rice, Alexander Singh Alvarado, Jonathan D. Sheaffer, Benjamin Bernard, David E. Romblom
  • Patent number: 11605599
    Abstract: A semiconductor device includes a semiconductor die having a front side surface, a backside surface opposite the front side surface and side faces. A backside metallization layer is deposited over the backside surface and projects laterally outwards beyond the side faces. A side face protection layer covers the side faces.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Christian Gruber, Benjamin Bernard, Tobias Polster, Carsten von Koblinski
  • Publication number: 20230036934
    Abstract: An electrically or partially electrically driven vehicle has a system (1) for active sound design. Active sound design sounds emitted by one or more loudspeakers (5) are modified depending on the driver type and/or depending on the current driving style. The system (1) has at least one sensor for recording measurement parameters (2) that permit a classification of a current driving style and/or a driver type of a driver of the vehicle. The device (1) has a classification device (3) that is configured to determine the current driving style and/or driver type of the driver of the vehicle based on the measurement parameters (2) recorded by the at least one sensor. The system (1) has a sound control system for controlling and modifying the sounds emitted by the loudspeakers (5) based on the current driving style and/or driver type classified by the classification device (3).
    Type: Application
    Filed: July 22, 2022
    Publication date: February 2, 2023
    Inventors: Benjamin Bernard, Bjoern Seinecke
  • Publication number: 20220339740
    Abstract: A method of splitting a semiconductor work piece includes: forming a separation zone within the semiconductor work piece, wherein forming the separation zone comprises modifying semiconductor material of the semiconductor work piece at a plurality of targeted positions within the separation zone in at least one physical property which increases thermo-mechanical stress within the separation zone relative to a remainder of the semiconductor work piece, wherein modifying the semiconductor material in one of the targeted positions comprises focusing at least two laser beams to the targeted position; and applying an external force or stress to the semiconductor work piece such that at least one crack propagates along the separation zone and the semiconductor work piece splits into two separate pieces. Additional work piece splitting techniques and techniques for compensating work piece deformation that occurs during the splitting process are also described.
    Type: Application
    Filed: March 10, 2022
    Publication date: October 27, 2022
    Inventors: Benjamin Bernard, Alexander Binter, Heimo Graf
  • Publication number: 20220262389
    Abstract: A method for improving speech intelligibility in a room includes detecting an active speaker, or speech, identifying the active speaker, and influencing at least one apparatus for producing sound for the room in such a way that the level of sound emitted into the room by this apparatus is reduced at frequencies or in frequency ranges that tally with or are adjacent to the frequencies, or frequency ranges, of the speaker that are relevant to speech intelligibility, and/or influencing at least one apparatus for producing sound for the room in such a way that the level of sound transmitted into the room is reduced by at least one apparatus for reducing sound by destructive interference at the frequencies or in the frequency ranges that are relevant to the speech intelligibility of the speaker or at frequencies or in frequency ranges that are adjacent to the frequencies or frequency ranges.
    Type: Application
    Filed: February 8, 2022
    Publication date: August 18, 2022
    Inventor: Benjamin Bernard
  • Publication number: 20220185468
    Abstract: A ducted fan of an aircraft includes a rotor-side fan and a stator-side duct that surrounds the rotor-side fan radially at the outside and defines a flow channel for air flowing via the fan. The stator-side duct has an inner wall that faces toward the rotor-side fan and which is perforated at least in certain sections. The stator-side duct has an outer wall that faces away from the fan. Between the inner wall and the outer wall of the stator-side duct, there are formed cavities which, forming sound-deadening resonators, are coupled via the perforated inner wall to the flow channel for the air flowing via the rotor-side fan. The cavities are filled, in a region which faces away from the inner wall and thus faces toward the outer wall, with activated carbon.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 16, 2022
    Inventor: Benjamin Bernard
  • Patent number: 11232802
    Abstract: Methods for converting, encoding, decoding and transcoding an acoustic field, more particularly a first-order Ambisonics three-dimensional acoustic field.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 25, 2022
    Assignee: Coronal Encoding S.A.S.
    Inventors: Benjamin Bernard, Francois Becker
  • Publication number: 20210331621
    Abstract: A method for simulating a noise in a motor vehicle includes the steps of defining a virtual noise source in a position outside the motor vehicle; simulating a noise from the virtual noise source, wherein the simulation takes place using real noise sources inside the motor vehicle; and changing the position of the virtual noise source relative to the motor vehicle depending on a speed of the motor vehicle.
    Type: Application
    Filed: February 23, 2021
    Publication date: October 28, 2021
    Applicant: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventor: Benjamin Bernard