Abstract: A chip scale power semiconductor device (16) provides improved heat dissipation. A semiconductor die (19) is mounted in a first region of a substrate (18). The substrate is extended to a second region for disposing terminals (38) to make external connections to the semiconductor device. Conductors (34) formed on the substrate electrically couple the semiconductor die to the terminals. The substrate is extended for a predetermined distance to separate the second region from the first region for isolating the temperature of the semiconductor die from the local temperature at the terminals.

Abstract: A bead for connecting cords. The bead includes holes therethrough through which the cords extend and adhesive in the holes for bonding the cords to the bead. A method is also described for adjusting the lengths of and connecting cords and includes the steps of fabricating a bead with holes, inserting cords through the holes, attaching a clamp to a cord whose length is to be adjusted, inserting shims between the bead and clamp so as to position the bead, introducing adhesive into the holes, and removing the clamp and shims.