Abstract: A force sensor assembly includes stress isolation features/geometry that blocks out unintended/off-axis forces/stress that would normally create an inaccurate force output. The force sensor assembly is a relatively low cost, high volume, weight minimizing design using robust automotive grade technology and is easily integrated into various applications due to a platform design approach. The piezoresistive MEMS are placed on stainless steel, which are minimized to allow for mass/cost reduction, therefore the other parts (PCB, element cover, customizable force bar) in the assembly are also minimized to allow for mass/cost reduction. The assembly is a simple 3-piece assembly that is easily integrated with minimal assembly processes. The automotive grade technology referenced is high pressure piezoresistive MEMS technology.

Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

Abstract: A method of creating a sealed, un-mated electrical connector system using single insertion press-fit pins. Using single insertion press-fit pins allows for use of simple plastic parts for the connector shroud and a true position assurance comb in conjunction with single insertion press-fit pins. The result is a lower cost for the final connector assembly. Less plastic is needed for the combined shroud and true position assurance comb, because the true position assurance is provided in part by the shroud, and in part by the position assurance comb.