Patents by Inventor Benjamin C. Lin

Benjamin C. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10119875
    Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: November 6, 2018
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Jen-Huang Albert Chiou, Benjamin C. Lin, Eric Matthew Vine
  • Publication number: 20160377496
    Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 29, 2016
    Inventors: Jen-Huang Albert Chiou, Benjamin C. Lin, Eric Matthew Vine
  • Patent number: 9293857
    Abstract: A method of creating a sealed, un-mated electrical connector system using single insertion press-fit pins. Using single insertion press-fit pins allows for use of simple plastic parts for the connector shroud and a true position assurance comb in conjunction with single insertion press-fit pins. The result is a lower cost for the final connector assembly. Less plastic is needed for the combined shroud and true position assurance comb, because the true position assurance is provided in part by the shroud, and in part by the position assurance comb.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: March 22, 2016
    Assignee: Continental Automotive Systems, Inc.
    Inventors: James D Baer, Benjamin C Lin, Timothy J Trento
  • Publication number: 20150064962
    Abstract: A method of creating a sealed, un-mated electrical connector system using single insertion press-fit pins. Using single insertion press-fit pins allows for use of simple plastic parts for the connector shroud and a true position assurance comb in conjunction with single insertion press-fit pins. The result is a lower cost for the final connector assembly. Less plastic is needed for the combined shroud and true position assurance comb, because the true position assurance is provided in part by the shroud, and in part by the position assurance comb.
    Type: Application
    Filed: August 8, 2014
    Publication date: March 5, 2015
    Inventors: James D. Baer, Benjamin C. Lin, Timothy J. Trento