Patents by Inventor Benjamin C. Smedley

Benjamin C. Smedley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods of processing substrates
    Patent number: 9393669
    Abstract: Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: July 19, 2016
    Assignee: Strasbaugh
    Inventors: William J. Kalenian, Thomas A. Walsh, Michael R. Vogtmann, Benjamin C. Smedley, Larry A. Spiegel, Thomas E. Brake
  • System and method for in situ monitoring of top wafer thickness in a stack of wafers
    Patent number: 8520222
    Abstract: A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: August 27, 2013
    Assignee: Strasbaugh
    Inventors: Frederic Anthony Schraub, Michael R. Vogtmann, Benjamin C. Smedley
  • System and Method for In Situ Monitoring of Top Wafer Thickness in a Stack of Wafers
    Publication number: 20130114090
    Abstract: A system for holding non-contact wafer probes over the surface of a wafer which includes a system for flushing the surface of the probe during grinding.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 9, 2013
    Inventors: Frederic Anthony Schraub, Michael R. Vogtmann, Benjamin C. Smedley