Patents by Inventor BENJAMIN CAPPI

BENJAMIN CAPPI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COPPER-CERAMIC SUBSTRATE
    Publication number: 20230399267
    Abstract: The invention relates to a copper-ceramic substrate comprising a ceramic support and at least one copper layer bonded to a surface of the ceramic support, the copper layer having a Cu content of at least 99.5% Cu, the copper layer having an Ag content of at least 50 ppm, and the copper layer having an Ag content of not more than 3000 ppm.
    Type: Application
    Filed: October 29, 2021
    Publication date: December 14, 2023
    Inventors: Benjamin CAPPI, Helge LEHMANN
  • COPPER STRIP FOR MAKING ELECTRICAL CONTACTS AND PROCESS FOR PRODUCING A COPPER STRIP AND CONNECTOR
    Publication number: 20210218171
    Abstract: The present invention concerns a copper strip for the making of electrical contacts, with a base material of copper or a copper alloy and a coating of tin, wherein the coating of tin has a proportion of insoluble, precipitation-forming elements of 0.003 to 1.0, preferably up to 0.5, preferably up to 0.05, particularly preferably up to 0.01 percent by weight. The invention further relates to a process for producing a copper strip for the manufacture of electrical contacts and a connector.
    Type: Application
    Filed: May 21, 2019
    Publication date: July 15, 2021
    Inventors: BENJAMIN CAPPI, HELGE LEHMANN, KARL ZEIGER
  • Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate
    Patent number: 10988418
    Abstract: The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 27, 2021
    Assignee: AURUBIS STOLBERG GMBH & CO. KG
    Inventors: Karl Zeiger, Benjamin Cappi, Helge Lehmann, Robert Koch
  • COPPER-CERAMIC SUBSTRATE
    Publication number: 20210002179
    Abstract: The invention relates to a copper-ceramic substrate comprising: a ceramic carrier, and at least one copper layer bonded to a surface of the ceramic carrier, which has a free surface for forming a conductor structure and/or for securing bonding wires, wherein the copper layer has a microstructure with an average grain size diameter of 200 to 500 ?m, preferably 300 to 400 ?m.
    Type: Application
    Filed: March 20, 2018
    Publication date: January 7, 2021
    Inventors: HELGE LEHMANN, KARL ZEIGER, BENJAMIN CAPPI
  • COPPER-CERAMIC SUBSTRATE, COPPER PRECURSOR FOR PRODUCING A COPPER-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A COPPER-CERAMIC SUBSTRATE
    Publication number: 20190002358
    Abstract: The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.
    Type: Application
    Filed: December 6, 2016
    Publication date: January 3, 2019
    Inventors: KARL ZEIGER, BENJAMIN CAPPI, HELGE LEHMANN, ROBERT KOCH