Patents by Inventor Benjamin Carroll

Benjamin Carroll has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
    Publication number: 20050238811
    Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
    Type: Application
    Filed: June 23, 2005
    Publication date: October 27, 2005
    Inventors: Roger Bernards, Joseph Bowers, Benjamin Carroll, Alvin Kucera