Abstract: The invention relates to a wafer scale process for the manufacture of optical waveguide devices, and particularly for the manufacture of ridge waveguide devices, and the improved waveguides made thereby. The present invention has found a process for achieving sub-micron control of an optical waveguiding layer thickness by providing a dimensionally stable wafer assembly into which adhesive can be introduced without altering the planar relationship between a carrier wafer and an optically transmissive wafer in wafer scale manufacture. This process permits wafer scale manufacture of optical waveguide devices including thin optically transmissive layers. A pattern of spacer pedestals is created by a deposition and etch back, or by a surface etch process to precisely reference surface information from a master surface to a carrier wafer to a thin optically transmissive wafer. The tolerance achievable in accordance with this process provides consistent yield across the wafer.

Abstract: A polarizing conversion system uses a polarizing beam splitter and reflector with a polarization conversion element to convert light from a lamp to a selected polarization state before providing the light to a light integrator, such as a light pipe or light tunnel. The light integrator provides homogenized polarized light to a light modulator. The polarization conversion system avoids increases efficiency compared to absorptive or simple reflective polarizers with fewer components than polarization conversion systems using patterned retarder plates and lenslet arrays. In one embodiment, the conversion elements are held to avoid adhesive or other bonds in the optical path. In other embodiments, high-temperature optical adhesive or optical contact bonding is used to assemble optical components for high-temperature operation. In a particular embodiment, a single-crystal quartz retarder plate is thermally matched to glass components in the polarization conversion system.