Abstract: The discussion relates to loading electronic assemblies on multi-shelf chasses. One example can include a vertical positioning mechanism configured to be secured to a multi-shelf chassis and to align a carrier supporting an electronic assembly with an individual shelf of the multi-shelf chassis. The example can also include a horizontal positioning mechanism configured to extend the carrier along the individual shelf and an anti-deflection mechanism configured to reduce downward deflection of the carrier when the carrier is extended into the electronic assembly loader tool along the individual shelf.

Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards, each including first and second subassemblies. Each of the subassemblies is surrounded in a longitudinal-lateral plane by a corresponding first or second perimeter frame. The first and second subassemblies have first and second operating temperatures, respectively. A first temperature tank is formed by first perimeter frames and substantially surrounds the first subassemblies. A second temperature tank is formed by second perimeter frames and substantially surrounds the second circuit card subassemblies. A first temperature cooling supply line selectively introduces the first cooling fluid into the first temperature tank for at least partially inducing the first operating temperature. A second temperature cooling supply line selectively introduces the second cooling fluid into the second temperature tank for at least partially inducing the second operating temperature.

Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.

Abstract: A bundle handling device is provided that includes a frame, a body, a scoop, a ramp and a controller. The body is mounted to the frame and includes a first opening through which bundles are loaded and a second opening through which bundles are discharged. The scoop and the ramp are mounted to the body. The scoop covers a substantial portion of the second opening, while the ramp covers the remaining portion. The controller is coupled to a plurality of actuators and a plurality of sensors, and controls the rotation of the body, the opening and closing of the scoop and the opening and closing of the ramp, in order to discharge a metered portion of bundles through the second opening.