Patents by Inventor Benjamin CHAU

Benjamin CHAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11072127
    Abstract: Process for forming a permanent join between two sections of fibrous material contained in a thermosetting resin matrix, said process comprising overlaying the two sections and subjecting the overlaid sections to ultrasonic welding to form a permanent join between the two sections, wherein there is no significant change in the sub-ambient Tg of the fibrous material contained in the thermosetting resin matrix in the region of the permanent join.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: July 27, 2021
    Assignee: HEXCEL COMPOSITES LIMITED
    Inventors: Marco Arcidiacono, John Ellis, Benjamin Chau
  • Publication number: 20190210295
    Abstract: Process for forming a permanent join between two sections of fibrous material contained in a thermosetting resin matrix, said process comprising overlaying the two sections and subjecting the overlaid sections to ultrasonic welding to form a permanent join between the two sections, wherein there is no significant change in the sub-ambient Tg of the fibrous material contained in the thermosetting resin matrix in the region of the permanent join.
    Type: Application
    Filed: June 7, 2017
    Publication date: July 11, 2019
    Applicant: HEXCEL COMPOSITES LIMITED
    Inventors: Marco ARCIDIACONO, John ELLIS, Benjamin CHAU