Patents by Inventor Benjamin Chee-Keong Tee

Benjamin Chee-Keong Tee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9281415
    Abstract: Sensors, sensing arrangements and devices, and related methods are provided. In accordance with an example embodiment, an impedance-based sensor includes a flexible dielectric material and generates an output based on pressure applied to the dielectric material and a resulting compression thereof. In certain embodiments, the dielectric material includes a plurality of regions separated by gaps and configured to elastically deform and recover in response to applied pressure.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: March 8, 2016
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Zhenan Bao, Stefan Christian Bernhardt Mannsfeld, Jason Locklin, Benjamin Chee-Keong Tee
  • Publication number: 20160049217
    Abstract: A battery electrode includes an electrochemically active material and a binder covering the electrochemically active material. The binder includes a self-healing polymer and conductive additives dispersed in the self-healing polymer to provide an electrical pathway across at least a portion of the binder.
    Type: Application
    Filed: November 8, 2013
    Publication date: February 18, 2016
    Inventors: Benjamin Chee-Keong Tee, Chao Wang, Hui Wu, Yi Cui, Zhenan Bao
  • Patent number: 9112058
    Abstract: Input devices are provided. In accordance with an example embodiment, an input device includes an interface layer that flexes in response to pressure, a plurality of sense electrodes, a dielectric between the sense electrodes and the interface layer, and interconnecting circuitry. The dielectric compresses or expands in response to movement of the interface layer, and exhibits dielectric characteristics that vary based upon a state of compression of the dielectric. The interconnecting circuitry is coupled to the sense electrodes and provides an output indicative of both the position of each sense electrode and an electric characteristic at each sense electrode that provides an indication of pressure applied to the dielectric adjacent the respective sense electrodes.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: August 18, 2015
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Zhenan Bao, Benjamin Chee-Keong Tee, Stefan Christian Bernhardt Mannsfeld, Justin P. Opatkiewicz
  • Publication number: 20120075241
    Abstract: Input devices are provided. In accordance with an example embodiment, an input device includes an interface layer that flexes in response to pressure, a plurality of sense electrodes, a dielectric between the sense electrodes and the interface layer, and interconnecting circuitry. The dielectric compresses or expands in response to movement of the interface layer, and exhibits dielectric characteristics that vary based upon a state of compression of the dielectric. The interconnecting circuitry is to the sense electrodes and provides an output indicative of both the position of each sense electrode and an electric characteristic at each sense electrode that provides an indication of pressure applied to the dielectric adjacent the respective sense electrodes.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 29, 2012
    Inventors: Zhenan Bao, Benjamin Chee-Keong Tee
  • Publication number: 20120062245
    Abstract: Sensors, sensing arrangements and devices, and related methods are provided. In accordance with an example embodiment, an impedance-based sensor includes a flexible dielectric material and generates an output based on pressure applied to the dielectric material and a resulting compression thereof. In certain embodiments, the dielectric material includes a plurality of regions separated by gaps and configured to elastically deform and recover in response to applied pressure.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 15, 2012
    Inventors: Zhenan Bao, Stefan Christian Bernhardt Mannsfeld, Jason Locklin, Benjamin Chee-Keong Tee