Patents by Inventor Benjamin Colin Heshmat

Benjamin Colin Heshmat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10782749
    Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wendell Lengefeld, Abhishek Mehta, William Mark Megarity, Mark E. Steinke, Benjamin Colin Heshmat
  • Publication number: 20200117250
    Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 16, 2020
    Inventors: Wendell Lengefeld, Abhishek Mehta, William Mark Megarity, Mark E. Steinke, Benjamin Colin Heshmat