Patents by Inventor Benjamin D. Trabin

Benjamin D. Trabin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
    Patent number: 11342301
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: May 24, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ai Jun Song, Jeremy Neyhart, Thomas Colosimo, Benjamin D. Trabin, Matthew B. Wasserman
  • BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS
    Publication number: 20210272926
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
    Type: Application
    Filed: May 19, 2021
    Publication date: September 2, 2021
    Inventors: Ai Jun Song, Jeremy Neyhart, Thomas Colosimo, Benjamin D. Trabin, Matthew B. Wasserman
  • Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
    Patent number: 11049839
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: June 29, 2021
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Ai Jun Song, Jeremy Neyhart, Thomas Colosimo, Benjamin D. Trabin, Matthew B. Wasserman
  • BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS
    Publication number: 20190229084
    Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 25, 2019
    Inventors: Ai Jun Song, Jeremy Neyhart, Thomas Colosimo, Benjamin D. Trabin, Matthew B. Wasserman