Patents by Inventor Benjamin D. Weil

Benjamin D. Weil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air-stable ink for scalable, high-throughput layer deposition
    Patent number: 8647897
    Abstract: A method for producing and depositing air-stable, easily decomposable, vulcanized ink on any of a wide range of substrates is disclosed. The ink enables high-volume production of optoelectronic and/or electronic devices using scalable production methods, such as roll-to-roll transfer, fast rolling processes, and the like.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: February 11, 2014
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Benjamin D. Weil, Stephen T. Connor, Yi Cui
  • Air-Stable Ink for Scalable, High-Throughput Layer Deposition
    Publication number: 20120244650
    Abstract: A method for producing and depositing air-stable, easily decomposable, vulcanized ink on any of a wide range of substrates is disclosed. The ink enables high-volume production of optoelectronic and/or electronic devices using scalable production methods, such as roll-to-roll transfer, fast rolling processes, and the like.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 27, 2012
    Applicant: The Board of Turstees of the Leland Stanford Junior University
    Inventors: Benjamin D. Weil, Stephen T. Connor, Yi Cui