Patents by Inventor Benjamin G. Chin

Benjamin G. Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Storage-stable advanced polymaleimide compositions
    Patent number: 5637387
    Abstract: The present invention relates to storage-stable advanced polymaleimide compositions and prepreg products manufactured therefrom comprising (A) an advanced polymaleimide reaction product resulting from the advancement reaction of a polyimide and an alkenyl phenol; and (B) a phenothiazine added to component (A) after advancement.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: June 10, 1997
    Assignee: Ciba-Geigy Corporation
    Inventors: Benjamin G. Chin, Roger Tietze
  • Flame retardant polyimide system
    Patent number: 5240981
    Abstract: The present invention relates to a polyimide resin composition and products, especially storage stable polyimide pre-pregs, manufactured therefrom with improved processing properties comprising (A) the reaction product of a polyimide, an alkenylphenol or an alkenylphenol ether, and tribromophenyl-maleimide, (B) an ionic or free-radical polymerization catalyst and (C) phenothiazine derivatives.
    Type: Grant
    Filed: June 3, 1991
    Date of Patent: August 31, 1993
    Assignee: Ciba-Geigy Corporation
    Inventors: Benjamin G. Chin, Roger Tietze
  • Method of making coaxial interconnection boards
    Patent number: 4908939
    Abstract: In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.
    Type: Grant
    Filed: January 5, 1988
    Date of Patent: March 20, 1990
    Assignee: Kollmorgen Corporation
    Inventors: Leonard Shieber, J. Philip Plonski, Michael Vignola, Benjamin G. Chin
  • Coaxial interconnection boards
    Patent number: 4743710
    Abstract: In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.
    Type: Grant
    Filed: October 18, 1985
    Date of Patent: May 10, 1988
    Assignee: Kollmorgen Technologies Corporation
    Inventors: Leonard Shieber, J. Philip Plonski, Michael Vignola, Benjamin G. Chin