Abstract: A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

Abstract: A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.

Abstract: Copper leads having an average grain size from 0.035 to 0.055 mm are thermocompression bonded to a metallized portion of a ceramic substrate. Surprisingly, such large grain size substantially decreases the "ceramic pullout" of the bonded leads.

Abstract: A lead frame (10) having external leads (26--26) and internal leads (22--22). The internal leads (22--22) are made of soft metal to provide bondability to ceramic substrates having a semiconductor chip thereon while the external leads (26--26) are hard metal to facilitate insertion thereof into a PWB. The lead frame (10) is fabricated by providing a hard metal strip (50) with a soft metal stripe (52) along the central portion thereof. Lead patterns (17--17) are punched in the strip (50) in such a manner as to punch the internal leads (22--22) from the soft metal while simultaneously punching most of the external leads (26--26) from the hard metal. The stripe (52) may be formed by annealing, inlaying or a separate piece of soft metal bonded to two outer hard metal sections (56--56).

Abstract: A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.